Hi Blair,

We actually haven't yet introduced BGAs to our assemblies.  That's
coming up early next year.  Right now, we're just trying to identify a
capable and repeatable inline X-ray machine to use for inspection after
the reflow process.

Whether or not we repair our defects is still being discussed and
methods being explored.  If rework does occur, I'm certain we won't be
reusing any components.  We've never done that here.

Leland

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Blair Hogg
Sent: Wednesday, October 07, 2009 8:20 AM
To: [log in to unmask]
Subject: Re: [TN] BGA X-Ray Defect Detection Capabilities

Just out of curiosity, when you detect an open on a BGA, what do you do?
I'm 
suspecting it is not practical to rework just the open sj, can you
reflow the 
entire BGA to get the open sj to form a connection, or remove and
reattach? 
Do you re-use the removed device or replace with a new one? 

Is the x-ray inspection really useful, or is it just to confirm a defect
found in 
test? Or does it detect defects before test so that they can be reworked
prior 
to testing?

Is the x-ray inspection useful for getting the profile parameters
correct, and 
then once the process is in control the inspection no longer adds value?

Thanks,

Blair

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