Transmissive X-ray excellent at bridges and mishappen joints, voids, skewed
placement.

Solder paste inspection verifies there is enough paste there, plugged
appatures or other paste defects will get you if you don't inspect. A good
profile for the oven. There are bad solder joints not detected by X-ray but
it is a fraction of a ppm for the solder joints inspected.

That will leave the occasional surprise from the PCB fab, contaminated PCB's
and components.

On Tue, Oct 6, 2009 at 4:09 PM, David D. Hillman <
[log in to unmask]> wrote:

> Hi Leland! We have integrated Xray technology in our BGA processes as a
> very success process control protocol. The primary use of Xray technology
> for us is solder ball/joint uniformity, void analysis and component
> placement/location. Xray technology doesn't find everything but is a good
> tool to have. Good Luck.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
>
> Leland Woodall <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
> 10/06/2009 01:18 PM
> Please respond to
> TechNet E-Mail Forum <[log in to unmask]>; Please respond to
> Leland Woodall <[log in to unmask]>
>
>
> To
> [log in to unmask]
> cc
>
> Subject
> Re: [TN] BGA X-Ray Defect Detection Capabilities
>
>
>
>
>
>
> Sounds like I?ve been led down a rosy pathway.  I thought these machines
> would do everything but serve you a cup of coffee.
>
>
>
> Both of them were 3D with an option to inspect in 2D (or provide a
> combination of the two).  If the 3D option is utilized and indeed
> inspecting every solder joint on one BGA, can the machine be ?tweaked?
> enough to assure we?ll catch all the opens, non-wets, and head-in-pillows?
>
>
>
> If not, I?ve got to back up and punt, and the defensive line is bearing
> down quickly!  Are there any other suggested options (other than not
> building a defect in the first place)?
>
>
>
> Nothing ever goes as planned?
>
>
>
> Leland
>
>
>
> From: [log in to unmask] [mailto:[log in to unmask]]
> Sent: Tuesday, October 06, 2009 1:44 PM
> To: [log in to unmask]; Leland Woodall
> Subject: Re: [TN] BGA X-Ray Defect Detection Capabilities
>
>
>
> Hi Leland,
> John Burke gave you good advice. Forget 2-D for the defects you are
> interested in, and 3-D is not much better except for some very specialized
> machines that look at SJs individually?bad part is of course, not very
> useful in mass production.
> Werner
>
>
>
>
>
> -----Original Message-----
> From: Leland Woodall <[log in to unmask]>
> To: [log in to unmask]
> Sent: Tue, Oct 6, 2009 11:55 am
> Subject: [TN] BGA X-Ray Defect Detection Capabilities
>
> Everyone,
>
>
>
>
>
>
>
>
>
> I just came back from an X-ray vendor qualification trip, and of course,
>
>
>
>
> have a few questions for my professional peers.
>
>
>
>
>
>
>
>
>
> Both vendors experienced problems reliably detecting opens and non-wets.
>
>
>
>
> I really didn't expect to see this, as I thought these would be two of
>
>
>
>
> the most common defects seen among BGA users.  We had to leave boards at
>
>
>
>
> both facilities so they could further develop their algorithms.
>
>
>
>
>
>
>
>
>
> We were not able to create a head-in-pillow defect, and thus, were not
>
>
>
>
> able to check their machines for this.  They also had no sample boards
>
>
>
>
> that carried such an anomaly.  Is this another defect that is difficult
>
>
>
>
> to detect, and must one utilize a 3D machine in order to fi
> nd it
>
>
>
>
> (assuming the machine is capable of both 2D and 3D inspections, and
>
>
>
>
> there are no components beneath the BGA)?
>
>
>
>
>
>
>
>
>
> Are there any other caveats you might be able to provide?  Our list of
>
>
>
>
> questions and qualification efforts were extensive, but I'm certain we
>
>
>
>
> missed something.  I just hope whatever it was fell outside of being a
>
>
>
>
> critical item...
>
>
>
>
>
>
>
>
>
> Thanks in advance,
>
>
>
>
>
>
>
>
>
> Leland
>
>
>
>
>
>
>
>
>
> ---------------------------------------------------
>
>
>
>
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
>
>
>
>
> To unsubscribe, send a message to [log in to unmask] with following text in
>
>
>
>
> the BODY (NOT the subject field): SIGNOFF Technet
>
>
>
>
> To temporarily halt or (re-start) delivery of Technet send e-mail to
>
>
>
>
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
>
>
>
>
> To receive ONE mailing per day of all the posts: send e-mail to
>
>
>
>
> [log in to unmask]: SET Technet Digest
>
>
>
>
> Search the archives of previous posts at: http://listserv.ipc.org/archives
>
>
>
>
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for
>
>
>
>
> additional information, or contact Keach Sasamori at [log in to unmask] or
>
>
>
>
> 847-615-7100 ext.2815
>
>
>
>
> -----------------------------------------------------
>
>
>
>
>
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16for additional information, or contact Keach Sasamori at
> [log in to unmask] or 847-615-7100 ext.2815
> -----------------------------------------------------
>

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------