Leland,
You should be able to catch most non-wets with a 2D just by tilting the
sample. I am talking about a GOOD 2D, off-line system with an
experienced operator. That would be my "depends".
Agilent claimed that their 3D x-ray machine (note, Agilent is getting
out of this market) could find head on pillow using an algorithm that
essentially looked at solder ball diameter (squashed out). However, you
could get the same effect with more solder paste, a bigger solder ball
and/or a nice big void in the component.
We have some beautiful 3D head on pillow defect pictures (if you can
call a defect in your product beautiful (just initial qualification
product, thank goodness). We got them using our lab-based, Fein Focus
Cougar with new software. It is not doing it joint by joint but takes
the x-ray images of the whole part and only takes a minute or two, but
the data examination takes longer. And the capture rate is around 90%,
but certainly not 100%.
I would believe you should be able to get similar results from a good
Phoenix, Dage or Xradia machine, but expect to pay for it. I can't say
anything about other companies with 3D capabilities.
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall
Sent: Tuesday, October 06, 2009 2:19 PM
To: [log in to unmask]
Subject: Re: [TN] BGA X-Ray Defect Detection Capabilities
Sounds like I've been led down a rosy pathway. I thought these machines
would do everything but serve you a cup of coffee.
Both of them were 3D with an option to inspect in 2D (or provide a
combination of the two). If the 3D option is utilized and indeed
inspecting every solder joint on one BGA, can the machine be "tweaked"
enough to assure we'll catch all the opens, non-wets, and
head-in-pillows?
If not, I've got to back up and punt, and the defensive line is bearing
down quickly! Are there any other suggested options (other than not
building a defect in the first place)?
Nothing ever goes as planned...
Leland
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Tuesday, October 06, 2009 1:44 PM
To: [log in to unmask]; Leland Woodall
Subject: Re: [TN] BGA X-Ray Defect Detection Capabilities
Hi Leland,
John Burke gave you good advice. Forget 2-D for the defects you are
interested in, and 3-D is not much better except for some very
specialized machines that look at SJs individually-bad part is of
course, not very useful in mass production.
Werner
-----Original Message-----
From: Leland Woodall <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, Oct 6, 2009 11:55 am
Subject: [TN] BGA X-Ray Defect Detection Capabilities
Everyone,
I just came back from an X-ray vendor qualification trip, and of course,
have a few questions for my professional peers.
Both vendors experienced problems reliably detecting opens and non-wets.
I really didn't expect to see this, as I thought these would be two of
the most common defects seen among BGA users. We had to leave boards at
both facilities so they could further develop their algorithms.
We were not able to create a head-in-pillow defect, and thus, were not
able to check their machines for this. They also had no sample boards
that carried such an anomaly. Is this another defect that is difficult
to detect, and must one utilize a 3D machine in order to fi
nd it
(assuming the machine is capable of both 2D and 3D inspections, and
there are no components beneath the BGA)?
Are there any other caveats you might be able to provide? Our list of
questions and qualification efforts were extensive, but I'm certain we
missed something. I just hope whatever it was fell outside of being a
critical item...
Thanks in advance,
Leland
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