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October 2009

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Subject:
From:
Werner Engelmaier /* <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 6 Oct 2009 13:44:05 -0400
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 Hi Leland,
John Burke gave you good advice. Forget 2-D for the defects you are interested in, and 3-D is not much better except for some very specialized machines that look at SJs individually—bad part is of course, not very useful in mass production.
Werner


 


 

-----Original Message-----
From: Leland Woodall <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, Oct 6, 2009 11:55 am
Subject: [TN] BGA X-Ray Defect Detection Capabilities










Everyone,

I just came back from an X-ray vendor qualification trip, and of course,
have a few questions for my professional peers.

Both vendors experienced problems reliably detecting opens and non-wets.
I really didn't expect to see this, as I thought these would be two of
the most common defects seen among BGA users.  We had to leave boards at
both facilities so they could further develop their algorithms.

We were not able to create a head-in-pillow defect, and thus, were not
able to check their machines for this.  They also had no sample boards
that carried such an anomaly.  Is this another defect that is difficult
to detect, and must one utilize a 3D machine in order to find it
(assuming the machine is capable of both 2D and 3D inspections, and
there are no components beneath the BGA)?

Are there any other caveats you might be able to provide?  Our list of
questions and qualification efforts were extensive, but I'm certain we
missed something.  I just hope whatever it was fell outside of being a
critical it
em...

Thanks in advance,

Leland

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