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October 2009

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Fri, 30 Oct 2009 07:41:56 -0400
Content-Type:
text/plain
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text/plain (171 lines)
IngeMar, what is the P content you target it too? 8%? Did you get any eye? In the process to select a vendor?  How many eyes? 
--------------------------
Sent using BlackBerry


----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Fri Oct 30 02:42:05 2009
Subject: Re: [TN] Al wire bonding

I like the thumb in the supplier's eye bit. :-)

Anil

-----Original Message-----
From: Inge [mailto:[log in to unmask]] 
Sent: Thursday, October 29, 2009 22:06
Subject: Re: Al wire bonding

Seconding what the best guru in America on bonding said. We have produced 
millions of boards with Al wire on ENIG for years. Works just fine IF you 
have the thumb in the board supplier's eye and do sample testing regularly 
(coupon test).
/Inge


----- Original Message ----- 
From: "Jason Zhao" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, October 29, 2009 2:50 PM
Subject: Re: [TN] Al wire bonding


Interesting.  I always think gold is the functional layer and the nickel is
there to prevent the copper migration to gold layers.

Regards,

Jason Zhao
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Creswick
Sent: Thursday, October 29, 2009 7:13 AM
To: [log in to unmask]
Subject: Re: [TN] Al wire bonding

Anat,

One can bond to the nickel [without the gold]!! This become especially easy
with heavier wire sizes [>2 mil].

Typically, one uses an ENIG plating.  The immersion gold results in a gold
flash of ~2-5µinches
The gold is merely there to protect the nickel from oxidizing too much.  One
actually bonds 'through' the gold layer to get to the underlying nickel.

If given a choice, I like pure soft gold instead of a hardened gold.  If you
use ENIG, you may not get much choice in your gold.

It is my opinion that the thermal history & chronology of the board has more
of an inpact on wire bond reliability than simple plating.  Eg - if one were
to reflow the board, [maybe] clean it, then let it set in que for multiple
weeks in a shop environment - I virtually guarantee you that you will note
differences in bonding characteristics as compared to a virgin board.

ENIG, or gold flash, is my answer.  Keep them moving - don't let them set
around, is my recommendation.

Steve Creswick





On Thu, Oct 29, 2009 at 3:38 AM, Anat Douek <[log in to unmask]> wrote:

>
>
> Hi,
> What is the min gold thickness required for reliable aluminum wire bonding
> ?
> Which gold type is prefered for this process?
> It is needed  for a military application.
>
> Regards,
> Anat Douek
> Process Engineer
> Herley General Microwave Israel
> tel. 972-25689455
>
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