TECHNET Archives

October 2009

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Peter L <[log in to unmask]>
Date:
Thu, 29 Oct 2009 23:54:44 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines)
Hi technet,

We have run into solderability issues with a major battery clip supplier. The 
battery clips are SMT on the board which then get installed into a remote 
control hand held shell. After SMT reflow the clip will shear off after slight 
push with a finger. External lab analysis (cross sectioning, solderability test) 
indicated internal nickel separations hence the nickel plating process was not 
robust and tightly controlled. After months of investigation we see impoved 
results but still failures.

Has anyone else experienced this type of issue before? We are evaluating 
different options including a change of vendor. Can someone share what they 
have been using in these type of application? Appreciate any comment.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2