At 11:51 AM 10/28/2009, Kenneth Wood wrote:
>Hi all,
>
>Is there a specific material I can use for via fill that is best for heat
>transfer for thermal vias?
as stated by others -- COPPER!
~300w/mK^2
>I use CB100
~3w/mK^2
That's 2 orders of lower than copper. A wee bit more annular copper
will gain you much more than a completely filled via with CB100.
>now but would like to know if there is something better I can
>use.
>
>Thanks
>
>Ken
>
>
>
>
>
>
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