Yeah, that's one of the reasons we're looking for something better.
I like the looks of that HSP 2741 stuff, seems you can build up an entire HS
on the back of the PCB with it.
Pretty cool
Ken

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Thayer, Wayne - IIW
Sent: Wednesday, October 28, 2009 4:06 PM
To: [log in to unmask]
Subject: Re: [TN] Via fill for heat transfer

You're still using CB100?!  This material causes problems with most anything
but the most tame processes and materials.  It outgases with multiple reflow
cycles--if you use it for a via-in-pad it can cause the solder to "rot".

Copper conducts real well, so extra plating/more vias do a great job.  In
conjunction with solder fill and multiple board planes I have always been
able to get the heat out of the part.

Wayne Thayer

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kenneth Wood
Sent: Wednesday, October 28, 2009 3:51 PM
To: [log in to unmask]
Subject: [TN] Via fill for heat transfer

Hi all,

Is there a specific material I can use for via fill that is best for heat
transfer for thermal vias?

I use CB100 now but would like to know if there is something better I can
use.

Thanks

Ken






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