There is no real reason to use additives, provided all the residues are 
sufficiently water soluble, including the metallic salts. I had many 
customers who did just this. There is no problem in the water getting 
under components, because the flux leaves more than sufficient 
surfactant to reduce the surface tension from ca. 72 dyne.cm to well 
under 30. However, that having been said, I strongly recommend you 
qualify the process for reliability before adopting it (ionic 
chromatography and SIR + service statistics) because there are 
water-soluble products and "water-soluble" products.

Brian

Rob Strecker wrote:
> I know it's late in the day today but I was wondering how many people
> out there are cleaning water soluble flux (leaded or lead free process)
> with straight DI water?  No chemicals added.  And have verified the
> boards are clean even under low profile parts.
> 
>  
> 
> Rob
> 
>  
> 
> 
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