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October 2009

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Subject:
From:
Leland Woodall <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Leland Woodall <[log in to unmask]>
Date:
Wed, 28 Oct 2009 10:44:14 -0400
Content-Type:
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text/plain (88 lines)
Vladimir,

Would my SEM perform this type of flux detection test, or what kind of
equipment would I use?

Leland

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev
Sent: Wednesday, October 28, 2009 8:36 AM
To: [log in to unmask]
Subject: Re: [TN] Birth of a Solderball

Hi Leland,

Cross-section won't tell you much. If you wave solder was "contaminated"
over time with Cu, you can try to use EDS to compare both of the
solders. Another hope is  the elemental composition of the fluxes. If
they are different, then you can use the same EDS to tell them apart.

Regards,

Vladimir
------Original Message------
From: Leland Woodall
Sender: TechNet
To: [log in to unmask]
ReplyTo: TechNet E-Mail Forum
ReplyTo: Leland Woodall
Sent: Oct 28, 2009 07:54
Subject: [TN] Birth of a Solderball

TechNetters,

Is there any possible way to determine the origin of a solder ball?
We've had a failure because of one, and we're trying to determine
whether it came from our SMT or wave soldering process.

We use SAC305 at both, so using the SEM to determine alloy composition
is not really helping.

The ball itself is spherical with no "tails" and quite shiny in
appearance.

If we cross section the ball, will we see a difference in grain
structure due to the differences in cool down rates?  Is there anything
else we can use or do?

Thanks in advance for your help!

Leland

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