One should also keep in mind that the elemental composition of such a tiny "creature" as a solder ball most probably will be different from the bulk composition. So any "high tech-high cost" analysis would be pretty much useless.
I said earlier what I'd do. Interestingly enough, I had a similar case (selective soldering, instead of wave, though) just last week and we were able to figure out the source based on the flux residue "signature".
Regards,
Vladimir
SENTEC
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
-----Original Message-----
From: Leland Woodall <[log in to unmask]>
Date: Wed, 28 Oct 2009 10:05:09
To: <[log in to unmask]>
Subject: Re: [TN] Birth of a Solderball
Hi Dave,
Just how many thousands of dollars would that cost, and to what kind of
testing do you refer?
And I really didn't want to perform a cross section as well, so that was
good news!
Leland
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Wednesday, October 28, 2009 8:50 AM
To: [log in to unmask]
Subject: Re: [TN] Birth of a Solderball
Hi Leland - It may come as a surprise to many engineers but many metal
alloys actually have a "DNA" which can be traced back to original
processes and/or original sources. Unfortunately, unless you can find an
elemental signature difference in the solder alloy you use in your wave
solder process versus your reflow process (which you will need something
more sophisticated that standard SEM assessment) you will not be able to
determine which process may have produced the solder ball. I don't
believe
that cross-sectional analysis will be beneficial unless you have some
baseline for comparison.
Dave Hillman
Rockwell Collins
[log in to unmask]
Leland Woodall <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
10/28/2009 06:54 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Leland Woodall <[log in to unmask]>
To
[log in to unmask]
cc
Subject
[TN] Birth of a Solderball
TechNetters,
Is there any possible way to determine the origin of a solder ball?
We've had a failure because of one, and we're trying to determine
whether it came from our SMT or wave soldering process.
We use SAC305 at both, so using the SEM to determine alloy composition
is not really helping.
The ball itself is spherical with no "tails" and quite shiny in
appearance.
If we cross section the ball, will we see a difference in grain
structure due to the differences in cool down rates? Is there anything
else we can use or do?
Thanks in advance for your help!
Leland
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