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October 2009

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Subject:
Reworking LF(SAC) Assemblies with SnPb Solder
From:
Dave Schaefer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dave Schaefer <[log in to unmask]>
Date:
Tue, 27 Oct 2009 10:52:55 -0500
Content-Type:
text/plain
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Working on a product that is exempt from RoHS requirements but does require
LF(SAC) processing because of BGA ball solder composition. Most other
products are standard SnPb process, and rework is performed with SnPb solder.

Am I correct to question the use of SnPb solder to rework the LF(SAC)
assemblies?

It would seem that mixing SnPB and SAC solder would result in an unknown
solder composition.

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