By any chance do you have excess to this form you stated to retrieve
this paper.

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Thursday, October 22, 2009 1:14 PM
To: [log in to unmask]
Subject: Re: [TN] BGA gluing

If I remember correctly, last IEEE ECTC conference, Sun microsystem got
a paper regarding this.  

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Thursday, October 22, 2009 2:09 PM
To: [log in to unmask]
Subject: [TN] BGA gluing

To all the TechNetters out there who use corner edge glue in their
processes and/or have knowledge of this practice.   What is the
adhesion/peel  strength of solder mask?    What force would it take to
lift external traces/conductor from the laminate?   In the ideal world
what added measurement of adhesion can I expect from the gluing process.

Vic.

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