Is anyone conducting pull test using an adhesive/epoxy for D&P. It has worked well for me for any size BGA, even CPU sockets.
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Thursday, October 22, 2009 5:47 AM
To: [log in to unmask]
Subject: Re: [TN] [spam] RE: [TN] ENIG Issue
Hi Inge,
Yes, I have done 'Dye & Pry.'
The 'prying' part is not easy for large components. I did it starting at the corners working piecemeal around the 4 sides.
LN2 is a god idea—I do not see how it would cause misleading results, please explain.
Werner
-----Original Message-----
From: Hernefjord Ingemar <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, Oct 22, 2009 4:44 am
Subject: [TN] [spam] RE: [TN] ENIG Issue
By the way, speaking SJ issues, has anyone of you experience from Die & Pray technology, like the one described by some guys, who tested large game boards, see figur 9 and 10, dye and pry testing? It's not easy to pry so large BGAs.
What kind of tools etc do you use? Myself, I had to dip the board under test in
LN2 before prying off the superBGA. That's not good, the low temperature can mislead the result.
/Inge
http://www.celestica.com/uploadedFiles/Home/PBfree_process_paper.pdf
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: onsdag 21 oktober 2009 15:51
To: [log in to unmask]
Subject: Re: [TN] ENIG Issue
Hi Vladimir,
Maybe we should simply drop the name 'Black Pad' entirely-too much baggage and confusion.
Maybe we should refer to them by their failure modes and damage mechanisms-solderability issues due to 'galvanic corrosion', brittle fracture due to P-enrichment, brittle fracture due to 'any other cause applicable.
Werner
-----Original Message-----
From: [log in to unmask]
To: Werner Engelmaier <[log in to unmask]>; [log in to unmask]
Sent: Wed, Oct 21, 2009 7:39 am
Subject: Re: [TN] ENIG Issue
Werner,
Yes, I agree that there are two different phenomena BP and BF, but I can not agree on the statement that the root cause for BF(brittle fracture) is high P content.
Regards,
Vladimir
SENTEC
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
From: Werner Engelmaier <[log in to unmask]>
Date: Tue, 20 Oct 2009 23:59:34 -0400
To: <[log in to unmask]>; <[log in to unmask]>
Subject: Re: [TN] ENIG Issue
Vladimir,
Indeed you sent me that ATOTECH paper, but I have several references that disagree with their definition, as well as others that agree with the Atotech paper.
There seem to be (at least) 2 different 'defects' at work-one with hyper-galvanic corrosion of the Ni during Au-plating causing soldering problems, and another causing brittle separation due to a weakened interface cause by too much P.
Are we in agreement on this?
I do not really care what you call either of them-clearly the root cause is different in these cases and so is what needs to be done.
Clearly, what we need is for the IPC to form a committee to provide proper definitions and 'names.'
Werner
-----Original Message-----
From: [log in to unmask]
To: TechNet E-Mail Forum <[log in to unmask]>; Werner Engelmaier <[log in to unmask]>
Sent: Tue, Oct 20, 2009 11:23 pm
Subject: Re: [TN] ENIG Issue
Werner,
We've been through it several times already. As far as I know, BP was defined as
a case of poor Ni-P plating with cavitation present in the layer. I think I sent
you an old ATOTECH paper on the topic a while ago.
Regards,
Vladimir
SENTEC
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
-----Original Message-----
From: Werner Engelmaier <[log in to unmask]>
Date: Tue, 20 Oct 2009 22:57:21
To: <[log in to unmask]>
Subject: Re: [TN] ENIG Issue
Hi Vladimir,
Then we are not communicating.
Please explain to me what YOU mean by 'BP failure'.
When I say 'BP failure', I mean it is because too much P between the Ni and the
IMC layers has weakened the bond leading to brittle separation on sufficient
loading. I do not differentiate as to the cause(s) for too much P. For me they
describe a damage mechanism.
You can similar appearance with too much and too little P.
Werner
-----Original Message-----
From: [log in to unmask]
To: Werner Engelmaier <[log in to unmask]>; [log in to unmask]
Sent: Tue, Oct 20, 2009 10:44 pm
Subject: Re: [TN] ENIG Issue
Werner,
You just confirmed what I said in my previous e-mail. You customer got failure
with black appeared pads, but it wasn't BP failure. Similar appearance doesn't
mean the same mechanism.
Regards,
Vladimir
SENTEC
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
From: Werner Engelmaier <[log in to unmask]>
Date: Tue, 20 Oct 2009 22:16:40 -0400
To: <[log in to unmask]>; <[log in to unmask]>
Subject: Re: [TN] ENIG Issue
Hi Vladimir,
I have one client who experienced 'Black Pad' after 9(!) soldering operations.
The P-content got progressively worse; it peaked with the EDS spikes for P being
as high as those for Sn.
Werner
-----Original Message-----
From: [log in to unmask]
To: TechNet E-Mail Forum <[log in to unmask]>; Werner Engelmaier
<[log in to unmask]>
Sent: Tue, Oct 20, 2009 10:07 pm
Subject: Re: [TN] ENIG Issue
Werner,
With all due respect, I don't think you are right.
Regards,
Vladimir
SENTEC
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
-----Original Message-----
From: Werner Engelmaier <[log in to unmask]>
Date: Tue, 20 Oct 2009 22:01:35
To: <[log in to unmask]>
Subject: Re: [TN] ENIG Issue
Hi George,
\While what you say in the first paragraph is correct, the second paragraph is
not.
'Black Pad' is not an all-or-nothing proposition. The seeds are sown at the
Ni-plating (not the Au-plating) with the P-codeposition. However, multiple or
lengthy expositions to high soldering temperatures result in more Ni being
dissolved to form IMCs leaving ever more P behind. This can create 'Black Pad'
where none existed before.
Werner
-----Original Message-----
From: George Milad <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, Oct 20, 2009 9:52 pm
Subject: Re: [TN] ENIG Issue
As always as soon as there is a solderability issue with ENIG, "Black pad"
comes up. This is a problem because it does not allow for further
investigation. Everyone accepts since this is ENIG then it must be black pad.
If this was a black pad issue the back side should have exhibited the same
problem. BP occurs during the plating of the gold on top of the Ni. BP
cannot differentiate one side from the other.
Do not accept BP as the answer and keep investigating.
Regards
George Milad
George Milad
National Accounts Manager for Technology
Uyemura International Corp (UIC)
249 Town Line Rd
Southington CT 06489
[log in to unmask]
Cell: (516) 901 3874
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