We spec 175 uin +/- 75uin with good results for many years and many 
millions of units successfully processed.

Why not spec Pd/Au?  Uhh..., cause ENIG is more widely available and 
works just fine when you don't work with cut rate suppliers?


At 07:15 PM 10/21/2009, Bob METCALF wrote:
>We recommend 150 to 240 micro inches.
>
>Regards,
>
>Bob Metcalf
>Atotech Western Regional Manager
>
>Cell 714-334-7667
>E-Mail [log in to unmask]
>
>This e-mail and any attachments hereto are business documents of Atotech
>USA Inc. and may contain CONFIDENTIAL OR PROPRIETARY BUSINESS INFORMATION.
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>use, disseminate or copy this message or any other files transmitted with
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>
>
>
>Victor Hernandez <[log in to unmask]>
>Sent by: TechNet <[log in to unmask]>
>10/21/2009 04:01 AM
>Please respond to
>TechNet E-Mail Forum <[log in to unmask]>; Please respond to
>[log in to unmask]
>
>
>To
>[log in to unmask]
>cc
>
>Subject
>Re: [TN] ENIG Issue
>
>
>
>
>
>
>Where are the recommended thickness values for Au/Ni on ENIG processes?
>Some vendors go below 50 micro inches in the nickel.
>
>Victor,
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Rex Waygood
>Sent: Wednesday, October 21, 2009 3:35 AM
>To: [log in to unmask]
>Subject: Re: [TN] ENIG Issue
>
>Dear Bill
>These are the causes that I have seen for the problem you describe.
>Porous/thin gold permitting passivation of the Ni which the first reflow
>makes much worse.
>Thin Ni causing copper to migrate through and produce a non-solderable
>surface under the gold, again the first reflow accelerates this.
>
>I have also seen passivated Ni under gold but that just makes all the
>components fall off in shear test or shock test, so it is reasonably
>apparent.
>
>I went through a period of wanting ENIG to disappear off the face of the
>earth. However over the years the process window for ENIG seems to have
>improved and our problems diminished.
>
>Perhaps I should not have said that.........................
>
>Rex
>
>Rex Waygood
>Technical Manager
>
>Hansatech EMS provides value manufacturing through engineering and
>quality
>
>Hansatech EMS Limited
>Benson Road
>Nuffield Industrial Estate
>Poole
>01202 338200
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
>Sent: 21 October 2009 00:21
>To: [log in to unmask]
>Subject: [TN] ENIG Issue
>
>Fellow TechNetters:  I ran into a problem and I am looking for more
>information.  We had some PCB made with ENIG for SMT applications.  We
>populated the backside, ran them through the convection oven, the solder
>fillets were fine.  Populated the first five (5) PCBs on the topside,
>ran them through the convection oven, and the solder fillets were quite
>bad, actually dewetted.  Could not even be touched up.  Tried two (2)
>more random PCBs and got the same results.  Never have run into this
>before but have been told it is NOT a unique problem.  Has anybody had
>this happen?  Have to tell our customer that they are not going to be
>getting their PCBs on time and would rather not look like the north end
>of a southbound mule.
>
>
>
>Thanks in advance for your assistance.
>
>
>
>Bill Black
>
>1 631 667 9699   X13
>
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