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October 2009

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From:
Vladimir Igoshev <[log in to unmask]>
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Date:
Wed, 21 Oct 2009 16:49:01 +0000
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Sure you can, but it wouldn't be a conventional way (too expensive). As one would say in Russian; more expensive then a brick bridge :-)



Vladimir

SENTEC

11 Canadian Road, Unit 7.

Scarborough, ON M1R 5G1

Tel: (416) 899-1882

Fax: (905) 882-8812

www.sentec.ca





-----Original Message-----

From: Inge <[log in to unmask]>

Date:         Wed, 21 Oct 2009 18:37:44 

To: <[log in to unmask]>

Subject: Re: [TN] ENIG Issue



Vlad,

Why not? You can etch with beam step by step into the pads and get an 

excellent depth profile too.

/Inge



----- Original Message ----- 

From: "Vladimir Igoshev" <[log in to unmask]>

To: <[log in to unmask]>

Sent: Wednesday, October 21, 2009 5:55 PM

Subject: Re: [TN] ENIG Issue





> Well, Auger would be an "overkill" for the case.

>

> Vladimir

> SENTEC

> 11 Canadian Road, Unit 7.

> Scarborough, ON M1R 5G1

> Tel: (416) 899-1882

> Fax: (905) 882-8812

> www.sentec.ca

>

>

> -----Original Message-----

> From: "Meeks, Stephen" <[log in to unmask]>

> Date:         Wed, 21 Oct 2009 08:26:35

> To: <[log in to unmask]>

> Subject: Re: [TN] ENIG Issue

>

> Bill,

>

> You may have a surface nickel issue that is affecting the solderability.

> There are very few in-line fixes, but for root cause, conduct a surface

> analysis study for a nickel rich surface (Auger). There may have been an

> issue during the fabrication ENIG process.

>

> Quick Test

> 1. Apply only solder paste to the panel conduct reflow (bottom or top)

> 2. Apply only solder paste to the second side and conduct reflow.

> 3. The "non" or dewetted panel will serve as a talking point with the

> board supplier.

>

> Stephen Meeks, Jr.

> Tel +1 480 502 6428

> Fax +1 480 502 6400

> [log in to unmask]

>

> -----Original Message-----

> From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]

> Sent: Tuesday, October 20, 2009 4:21 PM

> To: [log in to unmask]

> Subject: [TN] ENIG Issue

>

> Fellow TechNetters:  I ran into a problem and I am looking for more

> information.  We had some PCB made with ENIG for SMT applications.  We

> populated the backside, ran them through the convection oven, the solder

> fillets were fine.  Populated the first five (5) PCBs on the topside,

> ran them through the convection oven, and the solder fillets were quite

> bad, actually dewetted.  Could not even be touched up.  Tried two (2)

> more random PCBs and got the same results.  Never have run into this

> before but have been told it is NOT a unique problem.  Has anybody had

> this happen?  Have to tell our customer that they are not going to be

> getting their PCBs on time and would rather not look like the north end

> of a southbound mule.

>

>

>

> Thanks in advance for your assistance.

>

>

>

> Bill Black

>

> 1 631 667 9699   X13

>

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