Vladimir,
Voila, we achieved agreement.
Dobro.
Do svidaniya,
Werner
-----Original Message-----
From: [log in to unmask]
To: Werner Engelmaier <[log in to unmask]>
Sent: Wed, Oct 21, 2009 12:07 pm
Subject: Re: [TN] ENIG Issue
That is sound much better than calling everything BP :-)
SENTEC
11 Canadian Road, Unit 7.
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Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
From: Werner Engelmaier <[log in to unmask]>
Date: Wed, 21 Oct 2009 11:49:41 -0400
To: <[log in to unmask]>
Subject: Re: [TN] ENIG Issue
I did too.
O.k., so what is wrong with calling what we find by their <failure modes and
damage mechanisms>—<solderability issues due to 'galvanic corrosion'>,
<brittle fracture due to P-enrichment>, <brittle fracture due to...whatever>?
Werner
-----Original Message-----
From: [log in to unmask]
To: Werner Engelmaier <[log in to unmask]>
Sent: Wed, Oct 21, 2009 11:07 am
Subject: Re: [TN] ENIG Issue
I did, but I also saw cases of BF on "normal" ENIG
Vladimir
SENTEC
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
From: Werner Engelmaier <[log in to unmask]>
Date: Wed, 21 Oct 2009 10:53:11 -0400
To: <[log in to unmask]>
Subject: Re: [TN] ENIG Issue
Vladimir,
Are you telling me that you never saw BF as the result of P-enrichment? What about the client situation I talked about yesterday?
Werner
-----Original Message-----
From: [log in to unmask]
To: Werner Engelmaier <[log in to unmask]>
Sent: Wed, Oct 21, 2009 10:11 am
Subject: Re: [TN] ENIG Issue
Well, I'd say yes without connecting BF to P-enrichment :-)
Vladimir
SENTEC
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
From: Werner Engelmaier <[log in to unmask]>
Date: Wed, 21 Oct 2009 09:50:55 -0400
To: <[log in to unmask]>; <[log in to unmask]>
Subject: Re: [TN] ENIG Issue
Hi Vladimir,
Maybe we should simply drop the name 'Black Pad' entirely—too much baggage and confusion.
Maybe we should refer to them by their failure modes and damage mechanisms—solderability issues due to 'galvanic corrosion', brittle fracture due to P-enrichment, brittle fracture due to 'any other cause applicable.
Werner
-----Original Message-----
From: [log in to unmask]
To: Werner Engelmaier <[log in to unmask]>; [log in to unmask]
Sent: Wed, Oct 21, 2009 7:39 am
Subject: Re: [TN] ENIG Issue
Werner,
Yes, I agree that there are two different phenomena BP and BF, but I can not agree on the statement that the root cause for BF(brittle fracture) is high P content.
Regards,
Vladimir
SENTEC
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
From: Werner Engelmaier <[log in to unmask]>
Date: Tue, 20 Oct 2009 23:59:34 -0400
To: <[log in to unmask]>; <[log in to unmask]>
Subject: Re: [TN] ENIG Issue
Vladimir,
Indeed you sent me that ATOTECH paper, but I have several references that disagree with their definition, as well as others that agree with the Atotech paper.
There seem to be (at least) 2 different 'defects' at work—one with hyper-galvanic corrosion of the Ni during Au-plating causing soldering problems, and another causing brittle separation due to a weakened interface cause by too much P.
Are we in agreement on this?
I do not really care what you call either of them—clearly the root cause is different in these cases and so is what needs to be done.
Clearly, what we need is for the IPC to form a committee to provide proper definitions and 'names.'
Werner
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