TECHNET Archives

October 2009

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Hernefjord Ingemar <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Hernefjord Ingemar <[log in to unmask]>
Date:
Wed, 21 Oct 2009 14:09:07 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (240 lines)
Concord
/Inge
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M.
Sent: onsdag 21 oktober 2009 14:03
To: [log in to unmask]
Subject: Re: [TN] ENIG Issue

Rex,



Thank you for being honest.  If you follow TN faithfully you can read between the lines that there have been many who have wished ENIG would disappear off the face of the earth.  There have also some who still think ENIG is a good surface finish primarily because it has worked for them and they have not experienced an ENIG problem (yet).  Your last sentence and thee back and forth comments for the past 12 hours on TN point out the concerns I have about ENIG; 1st, "over the years the process window for ENIG seems to have improved and our problems diminished " 2nd, there still isn't agreement of what causes ENIG problems except that process control at the fabricator most have been the reason.



Regards,



George



George M. Wenger



Andrew Wireless Solutions



Senior Principal FMA / Reliability Engineer



40 Technology Drive, Warren, NJ 07059



(908) 546-4531 [Office]  (732) 309-8964 [Mobile]



[log in to unmask]





-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Rex Waygood
Sent: Wednesday, October 21, 2009 4:35 AM
To: [log in to unmask]
Subject: Re: [TN] ENIG Issue



Dear Bill

These are the causes that I have seen for the problem you describe.

Porous/thin gold permitting passivation of the Ni which the first reflow

makes much worse.

Thin Ni causing copper to migrate through and produce a non-solderable

surface under the gold, again the first reflow accelerates this.



I have also seen passivated Ni under gold but that just makes all the

components fall off in shear test or shock test, so it is reasonably

apparent.



I went through a period of wanting ENIG to disappear off the face of the

earth. However over the years the process window for ENIG seems to have

improved and our problems diminished.



Perhaps I should not have said that.........................



Rex



Rex Waygood

Technical Manager



Hansatech EMS provides value manufacturing through engineering and

quality



Hansatech EMS Limited

Benson Road

Nuffield Industrial Estate

Poole

01202 338200





-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]

Sent: 21 October 2009 00:21

To: [log in to unmask]

Subject: [TN] ENIG Issue



Fellow TechNetters:  I ran into a problem and I am looking for more

information.  We had some PCB made with ENIG for SMT applications.  We

populated the backside, ran them through the convection oven, the solder

fillets were fine.  Populated the first five (5) PCBs on the topside,

ran them through the convection oven, and the solder fillets were quite

bad, actually dewetted.  Could not even be touched up.  Tried two (2)

more random PCBs and got the same results.  Never have run into this

before but have been told it is NOT a unique problem.  Has anybody had

this happen?  Have to tell our customer that they are not going to be

getting their PCBs on time and would rather not look like the north end

of a southbound mule.







Thanks in advance for your assistance.







Bill Black



1 631 667 9699   X13



---------------------------------------------------

Technet Mail List provided as a service by IPC using LISTSERV 15.0 To

unsubscribe, send a message to [log in to unmask] with following text in

the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or

(re-start) delivery of Technet send e-mail to [log in to unmask]: SET

Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the

posts: send e-mail to [log in to unmask]: SET Technet Digest Search the

archives of previous posts at: http://listserv.ipc.org/archives Please

visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for

additional information, or contact Keach Sasamori at [log in to unmask] or

847-615-7100 ext.2815

-----------------------------------------------------



---------------------------------------------------

Technet Mail List provided as a service by IPC using LISTSERV 15.0

To unsubscribe, send a message to [log in to unmask] with following text in

the BODY (NOT the subject field): SIGNOFF Technet

To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)

To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest

Search the archives of previous posts at: http://listserv.ipc.org/archives

Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815

-----------------------------------------------------



---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2