Hi Vladimir,
Then we are not communicating.
Please explain to me what YOU mean by 'BP failure'.
When I say 'BP failure', I mean it is because too much P between the Ni and the IMC layers has weakened the bond leading to brittle separation on sufficient loading. I do not differentiate as to the cause(s) for too much P. For me they describe a damage mechanism.
You can similar appearance with too much and too little P.
Werner
-----Original Message-----
From: [log in to unmask]
To: Werner Engelmaier <[log in to unmask]>; [log in to unmask]
Sent: Tue, Oct 20, 2009 10:44 pm
Subject: Re: [TN] ENIG Issue
Werner,
You just confirmed what I said in my previous e-mail. You customer got failure with black appeared pads, but it wasn't BP failure. Similar appearance doesn't mean the same mechanism.
Regards,
Vladimir
SENTEC
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
From: Werner Engelmaier <[log in to unmask]>
Date: Tue, 20 Oct 2009 22:16:40 -0400
To: <[log in to unmask]>; <[log in to unmask]>
Subject: Re: [TN] ENIG Issue
Hi Vladimir,
I have one client who experienced 'Black Pad' after 9(!) soldering operations. The P-content got progressively worse; it peaked with the EDS spikes for P being as high as those for Sn.
Werner
-----Original Message-----
From: [log in to unmask]
To: TechNet E-Mail Forum <[log in to unmask]>; Werner Engelmaier <[log in to unmask]>
Sent: Tue, Oct 20, 2009 10:07 pm
Subject: Re: [TN] ENIG Issue
Werner,
With all due respect, I don't think you are right.
Regards,
Vladimir
SENTEC
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
-----Original Message-----
From: Werner Engelmaier <[log in to unmask]>
Date: Tue, 20 Oct 2009 22:01:35
To: <[log in to unmask]>
Subject: Re: [TN] ENIG Issue
Hi George,
\While what you say in the first paragraph is correct, the second paragraph is
not.
'Black Pad' is not an all-or-nothing proposition. The seeds are sown at the
Ni-plating (not the Au-plating) with the P-codeposition. However, multiple or
lengthy expositions to high soldering temperatures result in more Ni being
dissolved to form IMCs leaving ever more P behind. This can create 'Black Pad'
where none existed before.
Werner
-----Original Message-----
From: George Milad <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, Oct 20, 2009 9:52 pm
Subject: Re: [TN] ENIG Issue
As always as soon as there is a solderability issue with ENIG, "Black pad"
comes up. This is a problem because it does not allow for further
investigation. Everyone accepts since this is ENIG then it must be black pad.
If this was a black pad issue the back side should have exhibited the same
problem. BP occurs during the plating of the gold on top of the Ni. BP
cannot differentiate one side from the other.
Do not accept BP as the answer and keep investigating.
Regards
George Milad
George Milad
National Accounts Manager for Technology
Uyemura International Corp (UIC)
249 Town Line Rd
Southington CT 06489
[log in to unmask]
Cell: (516) 901 3874
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