Hi Vladimir,
It is a matter of definition, I guess.
In your case history on your website I see no evidence of BP—BP is not a solderability issue, but a 'brittle' separation' issue
Hyper-galvanic corrosion occurs during Au-plating as the result of insufficent protection of Ni by P—so I do not see this as BP, even though on the surface 'mud-cracking' at the grain boundaries with some dark (black) deposit is evident. This 'mud-cracking' is typically visible through the Au.
With PB the dark (black) areas are also away from the grain boundaries (but may not cover the whole surface).
Werner
-----Original Message-----
From: [log in to unmask]
To: TechNet E-Mail Forum <[log in to unmask]>; Werner Engelmaier <[log in to unmask]>
Sent: Tue, Oct 20, 2009 10:31 pm
Subject: Re: [TN] ENIG Issue
Here we go again :-) True BP is due to poor Ni plating (cavitation is evident in
Ni-P). Multiple re-flows have nothing to do with that.
I think you use the word (BP) in any cases of failure where Ni-P got exposed
(the surface look black), which I believe is wrong.
If you take a look at a case history on my website, I bet you will agree it had
nothing to do with BP, even though the pads looked black.
Regards,
Vladimir
SENTEC
www.sentec.ca
SENTEC
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
-----Original Message-----
From: Werner Engelmaier <[log in to unmask]>
Date: Tue, 20 Oct 2009 22:09:41
To: <[log in to unmask]>
Subject: Re: [TN] ENIG Issue
Hi Vladimir,
In what respect?
Werner
-----Original Message-----
From: [log in to unmask]
To: TechNet E-Mail Forum <[log in to unmask]>; Werner Engelmaier
<[log in to unmask]>
Sent: Tue, Oct 20, 2009 10:07 pm
Subject: Re: [TN] ENIG Issue
Werner,
With all due respect, I don't think you are right.
Regards,
Vladimir
SENTEC
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
-----Original Message-----
From: Werner Engelmaier <[log in to unmask]>
Date: Tue, 20 Oct 2009 22:01:35
To: <[log in to unmask]>
Subject: Re: [TN] ENIG Issue
Hi George,
\While what you say in the first paragraph is correct, the second paragraph is
not.
'Black Pad' is not an all-or-nothing proposition. The seeds are sown at the
Ni-plating (not the Au-plating) with the P-codeposition. However, multiple or
lengthy expositions to high soldering temperatures result in more Ni being
dissolved to form IMCs leaving ever more P behind. This can create 'Black Pad'
where none existed before.
Werner
-----Original Message-----
From: George Milad <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, Oct 20, 2009 9:52 pm
Subject: Re: [TN] ENIG Issue
As always as soon as there is a solderability issue with ENIG, "Black pad"
comes up. This is a problem because it does not allow for further
investigation. Everyone accepts since this is ENIG then it must be black pad.
If this was a black pad issue the back side should have exhibited the same
problem. BP occurs during the plating of the gold on top of the Ni. BP
cannot differentiate one side from the other.
Do not accept BP as the answer and keep investigating.
Regards
George Milad
George Milad
National Accounts Manager for Technology
Uyemura International Corp (UIC)
249 Town Line Rd
Southington CT 06489
[log in to unmask]
Cell: (516) 901 3874
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