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| Date: | Wed, 21 Oct 2009 02:45:22 +0000 |
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George,
ABSOLUTLY right!!!!!!
Vladimir
SENTEC
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
-----Original Message-----
From: "Wenger, George M." <[log in to unmask]>
Date: Tue, 20 Oct 2009 21:03:58
To: <[log in to unmask]>
Subject: Re: [TN] ENIG Issue
George,
Not everyone links solderability issues with ENIG to "Black Pad". In my email to Bill I didn't use those two words primarily because I believe they describe an appearance and not a failure mechanism.
Regards,
George
George M. Wenger
Andrew Wireless Solutions
Senior Principal FMA / Reliability Engineer
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 [Office] (732) 309-8964 [Mobile]
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of George Milad
Sent: Tuesday, October 20, 2009 9:52 PM
To: [log in to unmask]
Subject: Re: [TN] ENIG Issue
As always as soon as there is a solderability issue with ENIG, "Black pad"
comes up. This is a problem because it does not allow for further
investigation. Everyone accepts since this is ENIG then it must be black pad.
If this was a black pad issue the back side should have exhibited the same
problem. BP occurs during the plating of the gold on top of the Ni. BP
cannot differentiate one side from the other.
Do not accept BP as the answer and keep investigating.
Regards
George Milad
George Milad
National Accounts Manager for Technology
Uyemura International Corp (UIC)
249 Town Line Rd
Southington CT 06489
[log in to unmask]
Cell: (516) 901 3874
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