Well, as I usually say one good section can tell much more than "tons" of speculations. :-)



Vladimir

SENTEC

------Original Message------

From: George Milad

Sender: TechNet

To: [log in to unmask]

ReplyTo: TechNet E-Mail Forum

ReplyTo: [log in to unmask]

Sent: Oct 20, 2009 21:52

Subject: Re: [TN] ENIG Issue



As always as soon as there is a solderability issue with ENIG, "Black pad"  

comes up. This is a problem because it does not allow for further 

investigation.  Everyone accepts since this is ENIG then it must be black pad.

 

If this was a black pad issue the back side should have exhibited the same  

problem. BP occurs during the plating of the gold on top of the Ni. BP 

cannot  differentiate one side from the other.

 

Do not accept BP as the answer and keep investigating.

 

 

Regards

George Milad

George Milad

National Accounts  Manager for Technology

Uyemura International Corp (UIC)

249 Town Line Rd  

Southington CT 06489

[log in to unmask]

Cell: (516) 901  3874



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