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October 2009

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Werner Engelmaier <[log in to unmask]>
Date:
Tue, 20 Oct 2009 22:01:35 -0400
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text/plain (76 lines)
 Hi George,
\While what you say in the first paragraph is correct, the second paragraph is not.
'Black Pad' is not an all-or-nothing proposition. The seeds are sown at the Ni-plating (not the Au-plating) with the P-codeposition. However, multiple or lengthy expositions to high soldering temperatures result in more Ni being dissolved to form IMCs leaving ever more P behind. This can create 'Black Pad' where none existed before.
Werner


 


 

-----Original Message-----
From: George Milad <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, Oct 20, 2009 9:52 pm
Subject: Re: [TN] ENIG Issue










As always as soon as there is a solderability issue with ENIG, "Black pad"  
comes up. This is a problem because it does not allow for further 
investigation.  Everyone accepts since this is ENIG then it must be black pad.
 
If this was a black pad issue the back side should have exhibited the same  
problem. BP occurs during the plating of the gold on top of the Ni. BP 
cannot  differentiate one side from the other.
 
Do not accept BP as the answer and keep investigating.
 
 
Regards
George Milad
George Milad
National Accounts  Manager for Technology
Uyemura International Corp (UIC)
249 Town Line Rd  
Southington CT 06489
[log in to unmask]
Cell: (516) 901  3874

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