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October 2009

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From:
"Roberts, Jon (SA-1)" <[log in to unmask]>
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TechNet E-Mail Forum <[log in to unmask]>, Roberts, Jon (SA-1)
Date:
Tue, 20 Oct 2009 08:32:25 -0500
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Is the pictures in IPC-A-610D section 10.2.2 (10.13 and 10.14) represent fingerprint outline?  Just wondering, Thanks, Jon



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Reuven Rokah

Sent: Tuesday, October 20, 2009 8:05 AM

To: [log in to unmask]

Subject: Re: [TN] delamination signatures



Yes of course Bob.



She was traced and fired immediately (as reported by the Chinese vendor).





Best Regards



Reuven ROKAH 

Think green before printing this mail... Thanks





-----Original Message-----

From: Bob Willis [mailto:[log in to unmask]] 

Sent: Tuesday, October 20, 2009 2:52 PM

To: 'TechNet E-Mail Forum'; Reuven Rokah

Subject: RE: [TN] delamination signatures



Nice one I will have to search through my library for all the other things we use to leave inside boards. Guess you can do a CSI with the finger print and run it through Codus and find the person responsible.



Bob Willis

2 Fourth Ave, Chelmsford, Essex, CM1 4HA England

Tel: (44) 1245 351502

Fax: (44) 1245 496123

Mobile: 07860 775858

www.ASKbobwillis.com

www.SolderingStandards.com 

New Package on Package Workshops 24th November www.ASKbobwillis.com/PoPWorkshops.pdf 

PCB Inspection & Quality Control Workshop 3rd November www.ASKbobwillis.com/faworkshops.pdf

Book Bob's "Step by Step Failure Analysis Workshop"4th November  www.ASKbobwillis.com/faworkshops.pdf

Package on Package Assembly & Inspection Workshops 21th January ITRI www.ASKbobwillis.com/PoPWorkshops.pdf





-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Reuven Rokah

Sent: 20 October 2009 10:03

To: [log in to unmask]

Subject: Re: [TN] delamination signatures



There is also delamination caused by finger print stain on inner layers.

It usually round and have its finger print size.





Best Regards



Reuven ROKAH 

e mail: [log in to unmask]

Think green before printing this mail... Thanks



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Mahanna

Sent: Tuesday, October 20, 2009 3:24 AM

To: [log in to unmask]

Subject: [TN] delamination signatures



Hello TN,



I'm wondering how certain one can be about the root cause of delam. simply by reading its signature.  Our experience is similar to Paul Reid's (post attached below).  One obvious question: what about when it is both co and adhesive failure?

Are there other features to the signature that are important in determining primary root cause?



Chris



------------------------------------------------------------------------------------------



My sense is that moisture induced delamination presents as adhesive

delamination that is horizontal cracks that resemble blisters and are

located at a laminated interface (b-stage to c-stage or copper, or along

bundles of glass). It may be that the vapor pressure exerted by trapped

moisture induces a mechanical failure at laminated interfaces.



Material degradation induced delamination more often presents as

cohesive failure that may exhibit cracks with vertical sections, often

bifurcating and spanning across b-stage and c-stage material, even

through glass bundles, and tend to propagate with sharper angles. This

failure mode appears to be more a chemical degradation of the epoxy

system.



Sincerely,



Paul Reid





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