Hi Greg,

Depending on the rigidity of the adhesive and the type of components the
adhesive touches, unbalanced staking can cause say ceramic components to
crack/fracture. It is best practice to limit staking to the components
specified and prevent overflow onto adjacent components.  If you cannot
prevent overflow onto adjacent components, then it is best practice to
also properly stake that component as well.  Hope this helps.  Overflow
onto adjacent components is generally not desired or a good thing and
needs to be monitored and controlled closely.  

Best Regards,
-Joe M.


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From: TechNet [mailto:[log in to unmask]] On Behalf Of Gregg Owens
Sent: Monday, September 28, 2009 1:58 PM
To: [log in to unmask]
Subject: [TN] Component Staking

Hello all,

It's good to be back on TechNet once again. I have a question I could
directly answer so I thought I would put it out to the  friendly experts
of TechNet.

After soldering and during the component staking process some adhesive
has migrated onto adjacent solder connections and land areas. Could this
become detrimental in a high vibration environment? I know from 610 and
001 that adhesive shall not contaminate the creation of the solder
connection. However this is AFTER the soldering process is complete
would this be a concern?

Any thoughts? Thanks in advance,

Gregg Owens, CIT
Technical Writer - Avionics
Space Exploration Technologies
1 Rocket Road | Hawthorne | CA | 90250
310-363-6000
[log in to unmask]


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