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October 2009

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Subject:
From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:
Wed, 14 Oct 2009 10:12:19 -0700
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text/plain
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text/plain (122 lines)
So you're potentially available if you haven't over-buried your
capacitance?
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee parker
Sent: Wednesday, October 14, 2009 9:53 AM
To: [log in to unmask]
Subject: Re: [TN] FW: Call for Moderators for IPC APEX EXPO 2010 - free
one-day conference admission plus copy of proceedings

Kim

I would be happy to be a moderator so long as it does not interfere with
my paper on buried capacitance.

Best regards
Lee
J. L. Parker Ph. D.
JLP Consultants LLC
804 779 3389 
  ----- Original Message ----- 
  From: Kim Sterling<mailto:[log in to unmask]> 
  To: [log in to unmask]<mailto:[log in to unmask]> 
  Sent: Wednesday, October 14, 2009 9:50 AM
  Subject: [TN] FW: Call for Moderators for IPC APEX EXPO 2010 - free
one-day conference admission plus copy of proceedings


  Get involved at the world's premier technical conference for printed
boards and electronics manufacturing. We have openings for a number of
session moderators. Gain significant visibility for you and your company
and get a free one-day admission to the conference on the day you are a
moderator plus a copy of the conference proceedings.

  As a moderator, your responsibilities include: meeting with speakers
before the session, keeping the speakers on time, taking questions from
the audience, and posing questions of the speakers.
  Moderators are needed for the following sessions:
  Tuesday, April 6
  S01                     PCB Fabrication - 1:30 pm - 3:00 pm
  S06                     Chemistry of Plating - 3:15 pm - 4:45 pm
  Wednesday, April 7
  S14                            Business and Data Transfer - 9:00 am -
10:00 am
  S16                            Moisture Effects in Laminates - 10:15
am - 11:45 am
  S19                            POP I: The Practical Solution for Mixed
Function IC Integration - 10:15 am - 11:45 am
  S21                            Laminate Dielectric Properties and
Characterization - 1:30 pm - 3:30 pm
  S25                            Contamination and Corrosion II - 1:30
pm - 3:30 pm
  Thursday, April 8
  S26                            Environmental Regulation - 9:00 am -
10:00 am
  S27                            Printing I - 9:00 am - 10:00 am
  S29                            Assembly Process Optimization  - 9:00
am - 10:00 am
  S32                            Printing II - 10:15 am - 11:45 am
  S34                            POP II - 10:15 am - 11:45 am
  S35                            Lead Free Processing - 10:15 am - 11:45
am

  To sign up as a moderator, please send your name and contact
information, along with the name or number of the session(s) you are
interested in moderating, to
[log in to unmask]<mailto:[log in to unmask]<mailto:ToyaRichards
[log in to unmask]:[log in to unmask]>>. Also, please include
information on your qualifications to moderate the session such as
expertise in the topic.

  Thanks.

  Kim Sterling, IPC


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To temporarily halt or (re-start) delivery of Technet send e-mail to
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To receive ONE mailing per day of all the posts: send e-mail to
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Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
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---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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