TECHNET Archives

October 2009

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Louis Hart <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Louis Hart <[log in to unmask]>
Date:
Wed, 14 Oct 2009 10:11:18 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (58 lines)
Kim, I'd be happy to serve as moderator for S21, laminate dielectric properties and characterization.

I won't pretend to be the most qualified in this area, but my background includes PhD in physics from Duke, work at the Duke Materials Science department and IBM, plus 7 years in PCB fabrication and assembly. Louis Hart, Compunetics, 412-858-1272.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kim Sterling
Sent: Wednesday, October 14, 2009 9:51 AM
To: [log in to unmask]
Subject: [TN] FW: Call for Moderators for IPC APEX EXPO 2010 - free one-day conference admission plus copy of proceedings

Get involved at the world's premier technical conference for printed boards and electronics manufacturing. We have openings for a number of session moderators. Gain significant visibility for you and your company and get a free one-day admission to the conference on the day you are a moderator plus a copy of the conference proceedings.

As a moderator, your responsibilities include: meeting with speakers before the session, keeping the speakers on time, taking questions from the audience, and posing questions of the speakers.
Moderators are needed for the following sessions:
Tuesday, April 6
S01                     PCB Fabrication - 1:30 pm - 3:00 pm
S06                     Chemistry of Plating - 3:15 pm - 4:45 pm
Wednesday, April 7
S14                            Business and Data Transfer - 9:00 am - 10:00 am
S16                            Moisture Effects in Laminates - 10:15 am - 11:45 am
S19                            POP I: The Practical Solution for Mixed Function IC Integration - 10:15 am - 11:45 am
S21                            Laminate Dielectric Properties and Characterization - 1:30 pm - 3:30 pm
S25                            Contamination and Corrosion II - 1:30 pm - 3:30 pm
Thursday, April 8
S26                            Environmental Regulation - 9:00 am - 10:00 am
S27                            Printing I - 9:00 am - 10:00 am
S29                            Assembly Process Optimization  - 9:00 am - 10:00 am
S32                            Printing II - 10:15 am - 11:45 am
S34                            POP II - 10:15 am - 11:45 am
S35                            Lead Free Processing - 10:15 am - 11:45 am

To sign up as a moderator, please send your name and contact information, along with the name or number of the session(s) you are interested in moderating, to [log in to unmask]<mailto:[log in to unmask]>. Also, please include information on your qualifications to moderate the session such as expertise in the topic.

Thanks.

Kim Sterling, IPC


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2