Bill,
You may have a surface nickel issue that is affecting the solderability.
There are very few in-line fixes, but for root cause, conduct a surface
analysis study for a nickel rich surface (Auger). There may have been an
issue during the fabrication ENIG process.
Quick Test
1. Apply only solder paste to the panel conduct reflow (bottom or top)
2. Apply only solder paste to the second side and conduct reflow.
3. The "non" or dewetted panel will serve as a talking point with the
board supplier.
Stephen Meeks, Jr.
Tel +1 480 502 6428
Fax +1 480 502 6400
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: Tuesday, October 20, 2009 4:21 PM
To: [log in to unmask]
Subject: [TN] ENIG Issue
Fellow TechNetters: I ran into a problem and I am looking for more
information. We had some PCB made with ENIG for SMT applications. We
populated the backside, ran them through the convection oven, the solder
fillets were fine. Populated the first five (5) PCBs on the topside,
ran them through the convection oven, and the solder fillets were quite
bad, actually dewetted. Could not even be touched up. Tried two (2)
more random PCBs and got the same results. Never have run into this
before but have been told it is NOT a unique problem. Has anybody had
this happen? Have to tell our customer that they are not going to be
getting their PCBs on time and would rather not look like the north end
of a southbound mule.
Thanks in advance for your assistance.
Bill Black
1 631 667 9699 X13
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