TGASIA Archives

October 2009

TGAsia@IPC.ORG

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Subject:
From:
Jayme Lai <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, [log in to unmask][log in to unmask] Subject: Re: [TGAsia] Solder Balls Charles Solid content is very low but per your picture why there were much tacky residues on PCBA ,that¡¯s the reason you are difficult to remove solder balls. I don¡¯t know the configuration of wave solder in you side , Did you raise preheat temperature by 3-5¡æ ,I bet flux vendor can help you solve this problem Brandon From: TGAsia [mailto:[log in to unmask]] On Behalf Of charles.lee [...]40_24Oct200917:54:[log in to unmask]
Date:
Thu, 22 Oct 2009 10:38:13 +0800
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