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October 2009

TGAsia@IPC.ORG

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Subject:
From:
Lian Wei Liang - DG Product Engineering <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Lian Wei Liang - DG Product Engineering <[log in to unmask]>
Date:
Mon, 12 Oct 2009 13:05:20 +0800
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各位专家们,

目前有什么好的方法去除COB邦定IC上面的黑胶,我们公司当前的方法是用热风枪加热后铲掉,但这种方法很容易铲坏PCB线路板.

Regards,

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