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October 2009

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Subject:
From:
"Marcus L. Thompson" <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Sat, 3 Oct 2009 11:27:15 -0700
Content-Type:
text/plain
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text/plain (115 lines)
What about infant mortality and rework (not to mention field repair)?


--- Previous Message in This Thread ---
Subject: Re:[LF] leaded BGAs in lead free process?
From: Harvey Miller <[log in to unmask]>
To: [log in to unmask]
Date: Friday, October 02, 2009 7:55:18 AM

> Lead-free solder-- what a lose-lose proposition!!
> To reflow all solder and activate flux you have to heat the board
> to levels that damage the components and substrates.
> 
> Here's a better way:
> http://www.pcb007.com/pages/zone.cgi?a=53298&artpg=1
> Tell your CEO!
> 
> Harvey Miller
> 
> 
> 
> 
> ________________________________
> From: "Iven, Jowan" <[log in to unmask]>
> To: [log in to unmask]
> Sent: Friday, October 2, 2009 3:28:59 AM
> Subject: Re: [LF] leaded BGAs in lead free process?
> 
> Hello Peter,
> 
> You first have to understand/know  the impact of the lower profile.
> Dit the solder melt on every spot on the board?
> (What temperatures did the solderjoints reach)
> Is the flux completely activated?
> 
> But you also ran a leaded bga through an "adjusted" (?) leadfree
> process.
> I would not trust the quality of the board.
> The bga can be electrically damaged because of the higher temperatures
> And concerning reliability on the long term: a mixed bga  solderjoint
> has proven to be less reliable.
> 
> 
> Jowan Iven 
> 
> 
> -----Original Message-----
> From: Leadfree [mailto:[log in to unmask]] On Behalf Of Pete Houwen
> Sent: Thursday, October 01, 2009 4:57 PM
> To: [log in to unmask]
> Subject: [LF] leaded BGAs in lead free process?
> 
> We have a proto board that has a low impedance short between VCC and GND
> 
> that we can't track down.  We just got an "oh by the way" that the .8mm
> BGA 
> was leaded, but the board was run lead free.  He said he ran the profile
> lower 
> to "help"
> 
> I'm trying to imagine what happens to the leaded balls under those
> conditions, 
> and could it have caused the problem?  My initial assumption is loose
> solder 
> under there, but we don't have quick access to x-ray.
> 
> I'm not real high on this assembly shop, so the next suspect is the LGA 
> voltage converters.
> 
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