Subject: | |
From: | |
Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Fri, 2 Oct 2009 12:28:59 +0200 |
Content-Type: | text/plain |
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Hello Peter,
You first have to understand/know the impact of the lower profile.
Dit the solder melt on every spot on the board?
(What temperatures did the solderjoints reach)
Is the flux completely activated?
But you also ran a leaded bga through an "adjusted" (?) leadfree
process.
I would not trust the quality of the board.
The bga can be electrically damaged because of the higher temperatures
And concerning reliability on the long term: a mixed bga solderjoint
has proven to be less reliable.
Jowan Iven
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Pete Houwen
Sent: Thursday, October 01, 2009 4:57 PM
To: [log in to unmask]
Subject: [LF] leaded BGAs in lead free process?
We have a proto board that has a low impedance short between VCC and GND
that we can't track down. We just got an "oh by the way" that the .8mm
BGA
was leaded, but the board was run lead free. He said he ran the profile
lower
to "help"
I'm trying to imagine what happens to the leaded balls under those
conditions,
and could it have caused the problem? My initial assumption is loose
solder
under there, but we don't have quick access to x-ray.
I'm not real high on this assembly shop, so the next suspect is the LGA
voltage converters.
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