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Date: | Sat, 3 Oct 2009 08:45:07 +0300 |
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There is no real reason to use additives, provided all the residues are
sufficiently water soluble, including the metallic salts. I had many
customers who did just this. There is no problem in the water getting
under components, because the flux leaves more than sufficient
surfactant to reduce the surface tension from ca. 72 dyne.cm to well
under 30. However, that having been said, I strongly recommend you
qualify the process for reliability before adopting it (ionic
chromatography and SIR + service statistics) because there are
water-soluble products and "water-soluble" products.
Brian
Rob Strecker wrote:
> I know it's late in the day today but I was wondering how many people
> out there are cleaning water soluble flux (leaded or lead free process)
> with straight DI water? No chemicals added. And have verified the
> boards are clean even under low profile parts.
>
>
>
> Rob
>
>
>
>
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Technet Mail List provided as a service by IPC using LISTSERV 15.0
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Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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