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Sender:	TGAsia <[log in to unmask]>
X-To:	"[log in to unmask]" <[log in to unmask]>
Date:	Tue, 13 Oct 2009 09:22:31 -0500
Reply-To:	Asia Committe Task Group Forum <[log in to unmask]>, James Liu <[log in to unmask]>
Subject:	答复: [TGAsia] 有�l知道 PCBA 上BGA pad crack或PC B pad与Trace�氐��嗔�(一般在4��角) 的主要有哪些原因�е�.�x�x!
From:	James Liu <[log in to unmask]>
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主要是热胀系数不同造成的





Best Regards,



James Liu 刘春光

Director, Technology & Standardization 技术与标准总监

IPC China

上海市长宁区延安西路1088号2303室

Suite 2303，#1088 West Yan'an Rd., Changning, Shanghai 200052 PRC

Tel:   +86 21 5497 3435

Fax:  +86 21 5497 3437

MP:   +86 136 0133 3491

[log in to unmask]<mailto:[log in to unmask]>

www.ipc.org.cn<http://www.ipc.org.cn>

________________________________

发件人: TGAsia [[log in to unmask]] 代表 Andy Hao [[log in to unmask]]

发送时间: 2009年10月13日 10:10

收件人: Listserv TGAsia

主题: Re: [TGAsia] 有誰知道 PCBA 上BGA pad crack或PC B pad与Trace徹底斷裂(一般在4個角)的主要有哪些 原因導致.謝謝!



Dear 各位:



          有誰知道 PCBA 上BGA pad crack或PCB pad与Trace徹底斷裂(一般在4個角)的主要有哪些原因導致.謝謝!



Best Regards!

andy_hao{郝吉好}

Mobile: 15995700299

Tel: +86 512 62581988 Ext: 5637

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