Hi all
I have a Tin Lead component that I need to use in a Lead Free process (ELV).
What are the concerns with the small quantity of lead (Pb) from the plating
in the SAC solder joint?
I am concerned about the metallurgy side (leaded component materials e.g.
mold compound are LF process compliant) - will the lead content increase the
possibility of secondary reflow due to a low temperature phase or any other
reliability issues.
Thanks in advance
Moss
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