Hi Steve,
I'm not sure it was incredible vision, or just a lightbulb that went off at the right time with something that just happened to work for the membership. It has been gratifying to see how much value Technet has provided over the years. It is one of the successes that I cherish from my long time at IPC. (I'll let you in on another.... I pushed to have A-610 changed from a black and white to a color document :-) )
All the best!
Dave
David W. Bergman 大山人
Vice President, International Relations
IPC - Association Connecting Electronics Industries
3000 Lakeside Drive Suite 309 S Bannockburn, IL 60015-1249 USA
+1 847-597-2840 tel
+1 847-615-5640 fax
+1 847-867-1388 mobile
[log in to unmask]
www.ipc.org
-----Original Message-----
From: stephengregory5849 [mailto:[log in to unmask]]
Sent: Saturday, September 05, 2009 9:08 PM
To: Listserv Technet; David Bergman
Subject: Re: [TN] BGA/LGA land shape versus assembly yield reliability
Hi David!
Boy, you sure have brought backs some memories for me! I'm trying to
remember how it was that I first discovered the TechNet, and for the life of
me I can't remember. However it was, it has been the one constant in all of
my jobs over the years from California, to Oklahoma, to Pennsylvania where I
find myself now. It's really remarkable when I think about it.
I have never thanked you for your incredible vision in creating this forum,
because I never knew it was you who started TechNet. One day I would like to
shake your hand personally and express my thanks. But until then, you have
no idea how much the TechNet has been a part of my career in electronics.
Not only have I been helped with countless issues encountered in my job, I
have made so many friends from all over the world. My heartfelt thanks goes
out to you! You done good David!
Steve Gregory
----- Original Message -----
From: "David Bergman" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, September 04, 2009 1:59 PM
Subject: Re: [TN] BGA/LGA land shape versus assembly yield reliability
Hi Inge,
The formation of Technet was my idea. It came during a brainstorming
discussion with one of our TAEC Chairs Al Sorkin on how IPC should start
communicating using something called "e-mail" and get involved in the world
wide web. Al talked about email reflectors which led to the thought of
having a networking tool for the members to ask technical questions. That
lead us to install our "Pine" email system and early registration of the
domain www.ipc.org. Time frame was early nineties, I would have to really
dig to get more specific. We have technet archives back to 1995. I believe
95 and 96 were ported over. A post by Steve Gregory of Pragmatech on
25-APR-95 implies that it had been running for a bit.
Good day!
First I would like to express my thanks for the inputs I have received
in response to several of my requests in the past. They have all been very
helpful in resolving the issues that I needed help on, or when I needed
"another voice" to echo my position on certain issues. I think we all get
busy and sometimes neglect to acknowledge the efforts of others.
/ / \(..)/ ----- *
Steve Gregory
////// ' \/ ` ---- *
[log in to unmask]
*/*/ * // : : --- *
Pragmatech Incorporated
* /` '-- *
101 Nicholson Lane
*//..\\
San Jose, California 95134
Best regards,
Dave
David W. Bergman 大山人
Vice President, International Relations
IPC - Association Connecting Electronics Industries
3000 Lakeside Drive Suite 309 S Bannockburn, IL 60015-1249 USA
+1 847-597-2840 tel
+1 847-615-5640 fax
+1 847-867-1388 mobile
[log in to unmask]
www.ipc.org
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Friday, September 04, 2009 12:40 PM
To: Listserv Technet
Subject: Re: [TN] BGA/LGA land shape versus assembly yield reliability
What about the decomposition time for TechNetium? Seems to be a very stable
element , because we are same number of members since the start. A thought
came up in my mind: when did TN start and who was the creator ?
/Inge
----- Original Message -----
From: "Werner Engelmaier /*" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, September 04, 2009 4:12 PM
Subject: Re: [TN] BGA/LGA land shape versus assembly yield reliability
> Hi Joe,
>
> In the '80's, we at Bell Labs tries round, and rectangular pads. The ATC
> results showd a slight reliability advantage for solder joints resulting
> from rectangular pads. I have a paper in SMI sometimes in the early '90's
> [Bell Labs management would not let it be published at the time] with the
> data. The reason for the rectangular pads , by the way, was smaller
> possible pitch.
>
> Werner
>
>
> -----Original Message-----
> From: Joe Fjelstad <[log in to unmask]>
> To: [log in to unmask]
> Sent: Thu, Sep 3, 2009 8:10 pm
> Subject: [TN] BGA/LGA land shape versus assembly yield reliability
>
>
>
>
> Greetings folks.
>
> I did a quick check of the archives on the subject and drilled a dry well
> (maybe drilled in the wrong place?).
>
> That said, in design and lay out we all tend to match pad shapes on the
> board with their mates on the package (round hole - round peg , square
> hole -
> square peg)
>
> My question is has anyone looked at (or know of) round with square and
> vice versa and collected assembly efficacy/results and/or reliability
> data?
>
> Finite Element Modeling data would be of interest as well.
>
> Thanks in advance for any responses
>
> Joe
>
> Since its Friday in some place of the world (or soon will be) I was
> looking
> over the period table recently and afterwards was wondering if anyone had
> ever mentioned that this little forum has it very own element,
> TechNetium,
> the first man made element. (the upper case N is my suggestion for future
> spelling... ;-)
>
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847-615-7100 ext.2815
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