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September 2009

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Subject:
From:
Sherif Refaat <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Sherif Refaat <[log in to unmask]>
Date:
Mon, 7 Sep 2009 16:50:34 -0400
Content-Type:
text/plain
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text/plain (56 lines)
Hi Bev;

I can't say if Nortel used or didn't use ENIG boards with press fit
connectors. But in St-Laurent facility the hundreds of thousands of boards
that were built for OC192 program and other programs and had press fit
connectors were all built with Tin/Lead boards and only Tin/Lead boards. 

Regards;

Sherif 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Monday, September 07, 2009 3:48 PM
To: [log in to unmask]
Subject: Re: [TN] Need clever comments

Inge,
Well you will just have to wait until I can try and roust out an old Nortel
process engineer and get back to you.
Bev

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Monday, September 07, 2009 4:14 PM
To: [log in to unmask]
Subject: Re: [TN] Need clever comments

Inge,
Observation 1: How in the world can you make a connection between tin
whiskers and CAF?!!

Observation 2: If copper is "penetrating" the solder mask, it makes me
wonder what it is doing to the tin overlayer!  I would be concerned about
tin/copper intermetallic growing to the surface and oxidizing.

Q2 Popppycock!  Companies like Nortel and other put press fit connectors
into ENIG boards for years.  Of course it is always a good idea not to try
and put an elephant in a mouse hole.  Make sure the pin and hole are
dimensional matched, the pin is put in straight and the proper force, speed
and assembly apparatus are used to do it and that the end results are
cross-sectioned initially to make sure that it is right.

Bev
RIM

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