Observation 1: I don't make that coincidence, I ask you all about a possible 
connection. Why? Because my experience is that one anomaly is often followed 
by more. Like lack of vitamins can cause many diseases. But my main worry is 
the anomalous solder pad look and also the presence of copper on the solder 
mask surface.

Observation 2: in fact, if you study the conductor lines under strong light, 
there seems to be more copper colour than tin.

Q2: Well, is pressfit positive or negative with nickel plating. Ericsson, 
one of the biggest telecom companies, have forbidden pressfit + nickel 
plating. And you say that Nortel have done it for years. Who is poppycock?

Inge

----- Original Message ----- 
From: "Bev Christian" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, September 07, 2009 3:14 PM
Subject: Re: [TN] Need clever comments


> Inge,
> Observation 1: How in the world can you make a connection between tin
> whiskers and CAF?!!
>
> Observation 2: If copper is "penetrating" the solder mask, it makes me
> wonder what it is doing to the tin overlayer!  I would be concerned about
> tin/copper intermetallic growing to the surface and oxidizing.
>
> Q2 Popppycock!  Companies like Nortel and other put press fit connectors
> into ENIG boards for years.  Of course it is always a good idea not to try
> and put an elephant in a mouse hole.  Make sure the pin and hole are
> dimensional matched, the pin is put in straight and the proper force, 
> speed
> and assembly apparatus are used to do it and that the end results are
> cross-sectioned initially to make sure that it is right.
>
> Bev
> RIM
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Hernefjord Ingemar
> Sent: Monday, September 07, 2009 7:22 AM
> To: [log in to unmask]
> Subject: [TN] Need clever comments
>
>
> Hi all, need some professional backup regarding MIL quality boards.
>
> Objects: FR-4 Class III double-sided multi-layer boards, populated with
> SOICS, BGAs,and a lot of passive components.
>
> Observation 1 : the non soldered board have lots of Tin whiskers on inside
> of the PTH barrel. My thought is this: if whiskers can grow long before 
> the
> board is assembled, then ain't it likely that even CAF can be generated?
> See photo 1.
>
> Observation 2:  Copper has somehow penetrated the solder mask. This can be
> found everywhere along the conductor traces. You need a very good light
> microscope and a SEM to see it. See photo 2.
>
> Board data: Copper with 0.8 micrometer Immersion Tin. No nickel barrier.
> Solder mask thickness not specified.
>
> Application: Typical MIL-883 environment
>
> Q1: What is your opinion about that thin Tin directly on copper? I dislike
> the concept. Copper is very mobile at high temperatures, and combined with
> humidity, there can be leakage currents and corrosion issues. Even if the
> boards are CCd, there is a risk with copper .
>
> Q2: I gave  the advice to introduce a nickel barrier, but our customer
> claimed, that they can't because of pressfit connectors and pressfit test
> pins on the board. Furthermore, they had heard that one cannot have nickel
> platings when pressfitting, because the nickel will crack and oxidize and
> cause electrical disfunction. Is this your opinion too? Are there any
> relevant testing behind such statements?
>
> Thanks in advance
>
> Inge
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-615-7100 ext.2815
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to 
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to 
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 
> for additional information, or contact Keach Sasamori at [log in to unmask] or 
> 847-615-7100 ext.2815
> ----------------------------------------------------- 

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------