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Subject:	Re: BGA/LGA land shape versus assembly yield reliability
From:	stephengregory5849 <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, stephengregory5849 <[log in to unmask]>
Date:	Sat, 5 Sep 2009 22:07:46 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (217 lines)
Hi David!

Boy, you sure have brought backs some memories for me! I'm trying to 
remember how it was that I first discovered the TechNet, and for the life of 
me I can't remember. However it was, it has been the one constant in all of 
my jobs over the years from California, to Oklahoma, to Pennsylvania where I 
find myself now. It's really remarkable when I think about it.

I have never thanked you for your incredible vision in creating this forum, 
because I never knew it was you who started TechNet. One day I would like to 
shake your hand personally and express my thanks. But until then, you have 
no idea how much the TechNet has been a part of my career in electronics. 
Not only have I been helped with countless issues encountered in my job, I 
have made so many friends from all over the world. My heartfelt thanks goes 
out to you! You done good David!

Steve Gregory

----- Original Message ----- 
From: "David Bergman" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, September 04, 2009 1:59 PM
Subject: Re: [TN] BGA/LGA land shape versus assembly yield reliability


Hi Inge,

The formation of Technet was my idea.  It came during a brainstorming 
discussion with one of our TAEC Chairs Al Sorkin on how IPC should start 
communicating using something called "e-mail" and get involved in the world 
wide web. Al talked about email reflectors which led to the thought of 
having a networking tool for the members to ask technical questions. That 
lead us to install our "Pine" email system and early registration of the 
domain www.ipc.org.  Time frame was early nineties, I would have to really 
dig to get more specific.  We have technet archives back to 1995.  I believe 
95 and 96 were ported over.  A post by Steve Gregory of Pragmatech on 
25-APR-95 implies that it had been running for a bit.

Good day!

    First I would like to express my thanks for the inputs I have received
in response to several of my requests in the past. They have all been very
helpful in resolving the issues that I needed help on, or when I needed
"another voice" to echo my position on certain issues. I think we all get
busy and sometimes neglect to acknowledge the efforts of others.


     / /     \(..)/    ----- *     
        Steve Gregory       

    //////   ' \/ `   ---- *       
     [log in to unmask]    

   */*/ * // :    : --- *          
   Pragmatech Incorporated  

          * /`    '-- *            
      101 Nicholson Lane    

            *//..\\                
 San Jose, California 95134 






Best regards,
Dave

David W. Bergman   大山人
Vice President, International Relations
IPC - Association Connecting Electronics Industries
3000 Lakeside Drive Suite 309 S Bannockburn, IL 60015-1249 USA
+1 847-597-2840 tel
+1 847-615-5640 fax
+1 847-867-1388 mobile
[log in to unmask]
www.ipc.org


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Friday, September 04, 2009 12:40 PM
To: Listserv Technet
Subject: Re: [TN] BGA/LGA land shape versus assembly yield reliability

What about the decomposition time for TechNetium? Seems to be a very stable
element , because we are same number of members since the start. A thought
came up in my mind: when did TN start and who was the creator ?
/Inge


----- Original Message ----- 
From: "Werner Engelmaier /*" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, September 04, 2009 4:12 PM
Subject: Re: [TN] BGA/LGA land shape versus assembly yield reliability


> Hi Joe,
>
> In the '80's, we at Bell Labs tries round, and rectangular pads. The ATC
> results showd a slight reliability advantage for solder joints resulting
> from rectangular pads. I have a paper in SMI sometimes in the early '90's
> [Bell Labs management would not let it be published at the time] with the
> data. The reason for the rectangular pads , by the way, was smaller
> possible pitch.
>
> Werner
>
>
> -----Original Message-----
> From: Joe Fjelstad <[log in to unmask]>
> To: [log in to unmask]
> Sent: Thu, Sep 3, 2009 8:10 pm
> Subject: [TN] BGA/LGA land shape versus assembly yield reliability
>
>
>
>
> Greetings folks.
>
> I did a quick check of the archives on the subject and drilled a dry  well
> (maybe drilled in the wrong place?).
>
> That said, in design and lay out we all tend to match pad shapes on  the
> board with their mates on the package (round hole - round peg , square
> hole  -
> square peg)
>
> My question is has anyone looked at (or know of) round with square and
> vice versa and collected assembly efficacy/results and/or reliability
> data?
>
> Finite Element Modeling data would be of interest as well.
>
> Thanks in advance for any responses
>
> Joe
>
> Since its Friday in some place of the world (or soon will be) I was
> looking
> over the period table recently and afterwards was wondering if anyone  had
> ever mentioned that this little forum has it very own element,
> TechNetium,
> the first man made element. (the upper case N is my  suggestion for future
> spelling... ;-)
>
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> 847-615-7100 ext.2815
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Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to 
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to 
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 
for additional information, or contact Keach Sasamori at [log in to unmask] or 
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to 
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to 
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 
for additional information, or contact Keach Sasamori at [log in to unmask] or 
847-615-7100 ext.2815
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Technet Mail List provided as a service by IPC using LISTSERV 15.0
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the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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