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September 2009

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Subject:
From:
Robert Kondner <[log in to unmask]>
Reply To:
Date:
Fri, 4 Sep 2009 14:05:07 -0400
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When reworking Gull Wing devices by hand, and using a broad tip, I would
expect a round pad to pull the solder filaments away from each other. 

 I never played with that. Has anyone tried it?

Bob Kondner


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Friday, September 04, 2009 1:40 PM
To: [log in to unmask]
Subject: Re: [TN] BGA/LGA land shape versus assembly yield reliability

What about the decomposition time for TechNetium? Seems to be a very stable 
element , because we are same number of members since the start. A thought 
came up in my mind: when did TN start and who was the creator ?
/Inge


----- Original Message ----- 
From: "Werner Engelmaier /*" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, September 04, 2009 4:12 PM
Subject: Re: [TN] BGA/LGA land shape versus assembly yield reliability


> Hi Joe,
>
> In the '80's, we at Bell Labs tries round, and rectangular pads. The ATC 
> results showd a slight reliability advantage for solder joints resulting 
> from rectangular pads. I have a paper in SMI sometimes in the early '90's 
> [Bell Labs management would not let it be published at the time] with the 
> data. The reason for the rectangular pads , by the way, was smaller 
> possible pitch.
>
> Werner
>
>
> -----Original Message-----
> From: Joe Fjelstad <[log in to unmask]>
> To: [log in to unmask]
> Sent: Thu, Sep 3, 2009 8:10 pm
> Subject: [TN] BGA/LGA land shape versus assembly yield reliability
>
>
>
>
> Greetings folks.
>
> I did a quick check of the archives on the subject and drilled a dry  well
> (maybe drilled in the wrong place?).
>
> That said, in design and lay out we all tend to match pad shapes on  the
> board with their mates on the package (round hole - round peg , square 
> hole  -
> square peg)
>
> My question is has anyone looked at (or know of) round with square and
> vice versa and collected assembly efficacy/results and/or reliability 
> data?
>
> Finite Element Modeling data would be of interest as well.
>
> Thanks in advance for any responses
>
> Joe
>
> Since its Friday in some place of the world (or soon will be) I was 
> looking
> over the period table recently and afterwards was wondering if anyone  had
> ever mentioned that this little forum has it very own element, 
> TechNetium,
> the first man made element. (the upper case N is my  suggestion for future
> spelling... ;-)
>
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Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
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847-615-7100 ext.2815
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Technet Mail List provided as a service by IPC using LISTSERV 15.0
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Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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