TECHNET Archives

September 2009

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Werner Engelmaier /* <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 4 Sep 2009 10:55:06 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (244 lines)
Hi joe, 

matching pads---as I said, I published this in SMI.

Werner








-----Original Message-----
From: Joe Fjelstad <[log in to unmask]>
To: [log in to unmask]
Sent: Fri, Sep 4, 2009 9:40 am
Subject: Re: [TN] BGA/LGA land shape versus assembly yield reliability



? Hi Werner

Thanks, that kind of fits with my instincts. Were they both sides the same or 
did you see any results from mixed pad assemblies and do you think that the data 
might ever make its way to light?

Thanks again

Very best, 
Joe

BTW I had my first taste of Glenmorangie scotch (10 year old) the other evening. 
I appreciate your choice.? 


 


 



?

?

Werner Engelmaier /* wrote:?

> Hi Joe,?

>?

> In the '80's, we at Bell Labs tries round, and rectangular pads. The ATC 
results showd a slight reliability advantage for solder joints resulting from 
rectangular pads. I have a paper in SMI sometimes in the early '90's [Bell Labs 
management would not let it be published at the time] with the data. The reason 
for the rectangular pads , by the way, was smaller possible pitch.?

>?

> Werner?

>?

>?

> -----Original Message-----?

> From: Joe Fjelstad <[log in to unmask]>?

> To: [log in to unmask]

> Sent: Thu, Sep 3, 2009 8:10 pm?

> Subject: [TN] BGA/LGA land shape versus assembly yield reliability?

>?

>?

>?

>?

> Greetings folks. 
>  
> I did a quick check of the archives on the subject and drilled a dry  well 
> (maybe drilled in the wrong place?). 
>  
> That said, in design and lay out we all tend to match pad shapes on  the 
> board with their mates on the package (round hole - round peg , square hole  - 

> square peg)  
>  
> My question is has anyone looked at (or know of) round with square and  
> vice versa and collected assembly efficacy/results and/or reliability  data? 
>  
> Finite Element Modeling data would be of interest as well.  
>  
> Thanks in advance for any responses?

>  
> Joe?

>  
> Since its Friday in some place of the world (or soon will be) I was looking 
>  over the period table recently and afterwards was wondering if anyone  had 
> ever mentioned that this little forum has it very own element,  TechNetium, 
> the first man made element. (the upper case N is my  suggestion for future 
> spelling... ;-)  
>?

> ---------------------------------------------------?

> 
Technet Mail List provided as a service by IPC using LISTSERV 15.0?

> To unsubscribe, send a message to [log in to unmask] with following text in?

> the BODY (NOT the subject field): SIGNOFF Technet?

> To temporarily halt or (re-start) delivery of Technet send e-mail to 
> [log in to unmask]: SET Technet NOMAIL or (MAIL)?

> To receive ONE mailing per day of all the posts: send e-mail to 
> [log in to unmask]: SET Technet Digest?

> Search the archives of previous posts at: http://listserv.ipc.org/archives?

> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for 

> additional information, or contact Keach Sasamori at [log in to unmask] or 
> 847-615-7100 ext.2815?

> -----------------------------------------------------?

>?

>?

> ---------------------------------------------------?

> Technet Mail List provided as a service by IPC using LISTSERV 15.0?

> To unsubscribe, send a message to [log in to unmask] with following text in?

> the BODY (NOT the subject field): SIGNOFF Technet?

> To temporarily halt or (re-start) delivery of Technet send e-mail to 
[log in to unmask]: SET Technet NOMAIL or (MAIL)?

> To receive ONE mailing per day of all the posts: send e-mail to 
[log in to unmask]: SET Technet Digest?

> Search the archives of previous posts at: http://listserv.ipc.org/archives?

> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for 
additional information, or contact Keach Sasamori at [log in to unmask] or 
847-615-7100 ext.2815?

> -----------------------------------------------------?

>?

>   ?

-- 
Eric Christison Msc?

Mechanical Engineer?

Consumer & Micro group?

Imaging Division?
?

STMicroelectronics (R&D) Ltd?

33 Pinkhill?

Edinburgh EH12 7BF?

United Kingdom?
?

Tel:    +44 (0)131 336 6165?

Fax:    + 44 (0)131 336 6001?
?

---------------------------------------------------?

Technet Mail List provided as a service by IPC using LISTSERV 15.0?

To unsubscribe, send a message to [log in to unmask] with following text in?

the BODY (NOT the subject field): 
SIGNOFF Technet?

To temporarily halt or (re-start) delivery of Technet send e-mail to 
[log in to unmask]: SET Technet NOMAIL or (MAIL)?

To receive ONE mailing per day of all the posts: send e-mail to 
[log in to unmask]: SET Technet Digest?

Search the archives of previous posts at: http://listserv.ipc.org/archives?

Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for 
additional information, or contact Keach Sasamori at [log in to unmask] or 
847-615-7100 ext.2815?

-----------------------------------------------------?



 


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to 
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to 
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for 
additional information, or contact Keach Sasamori at [log in to unmask] or 
847-615-7100 ext.2815
-----------------------------------------------------


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2