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September 2009

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Subject:
From:
Dean Stadem <[log in to unmask]>
Reply To:
Date:
Fri, 4 Sep 2009 09:12:16 -0500
Content-Type:
text/plain
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text/plain (109 lines)
But TN does have two Hillmans, Craig and Dave. Must be from Fortran
equation stating: Iff surname = Hillman, then goto Very Smart Guy.
Gotta be the genetics connection. Sure to be some Scandihooovian in
there somewhere.

R. Dean Stadem
Consulting Engineer
Analog Technologies Corp./Lumagine, Inc.
11441 Rupp Drive
Burnsville, MN 55431
(952)894-9228
[log in to unmask]


-----Original Message-----
From: Inge [mailto:[log in to unmask]] 
Sent: Thursday, September 03, 2009 3:05 PM
To: Dean Stadem; [log in to unmask]
Subject: Re: [TN] BGA Pb-free, this is what I feared: Tin whiskers

So TN have two Stadems.
Inge
----- Original Message -----
From: "Dean Stadem" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, September 03, 2009 9:55 PM
Subject: Re: [TN] BGA Pb-free, this is what I feared: Tin whiskers


>I would not send them to the PA immigrant, they might get stolen!
> Just kidding, Steve. Any more developments on that?
>
> R. Dean Stadem
> Consulting Engineer
> Analog Technologies Corp./Lumagine, Inc.
> 11441 Rupp Drive
> Burnsville, MN 55431
> (952)894-9228
> [log in to unmask]
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
> Sent: Thursday, September 03, 2009 2:16 PM
> To: [log in to unmask]
> Subject: [TN] BGA Pb-free, this is what I feared: Tin whiskers
>
> We have HASL and via-in-pad. Electrical issues, disturbed signals.
There
> were hundreds of Tin whiskers on inside of the unfilled vias, and even
> whiskers from solder pads circumperiphery, pointing at the nearby
solder
> pads. I suspect that the signal failures are caused by CAFs. Have any
of
> you
> seen a connection between the presence of Tin whiskers and CAF growth?
>
> All BGA via-in-pads are solder mask defined. If you want photos, I can
> send
> a couple to the PA immigrant.
>
> /Inge
>
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