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September 2009

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Subject:
From:
"Carroll, Thomas A" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Carroll, Thomas A
Date:
Fri, 4 Sep 2009 06:45:26 -0700
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text/plain
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text/plain (84 lines)
Paul,

ASTM B-579, Standard Specification for Electrodeposited Coating of
Tin-Lead Alloy (Solder Plate), is normally used.  I do not know of an
IPC specification for this process.

Regards,
Tom Carroll, CQA, CIT
Supplier Quality Engineer
Boeing Integrated Defense Systems - East Region Supplier Quality
Home Office Phone/FAX: 845-753-5932
Temp Office Phone at Alabama Aircraft Indus Inc (205) 510-4783
Temp Office FAX at AAII (205) 592-0295
Boeing Cell: 215-692-2463
email: [log in to unmask]

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-----Original Message-----
From: Paul Reid [mailto:[log in to unmask]] 
Sent: Friday, September 04, 2009 8:25 AM
To: [log in to unmask]
Subject: [TN] Tin Lead Plate Specification

One of our customers is asking for IPC specifications for electroplated
tin lead. My sense is that plated tin lead may not be specified by IPC
as it is an intermediate step in PWB fabrication. Intermediate in that
tin lead may be used as an etch resist that is later fused to produce  a
solder finish, subjected to HASL and replaced in the process, or
stripped for the application of another surface finish like ENiG.

Is there a specification for tin lead plating and, if so, can someone
direct me to the appropriate document?

Sincerely,

Paul Reid

Program Coordinator

PWB Interconnect Solutions Inc.
235 Stafford Rd., West, Unit 103
Nepean, Ontario
Canada, K2H 9C1

613 596 4244 ext. 229
Skype paul_reid_pwb
[log in to unmask] <mailto:[log in to unmask]>


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