Hi Kevin,
Ag-embrittlement, as are Au-embrittlement and Pd-embrittlement, are only an issue when you have high enough plating thicknesses which cannot be achieved with immersion plating processes. Immersion plating processes are self-limiting; all other processes can be problematic.
Werner
-----Original Message-----
From: Glidden, Kevin <[log in to unmask]>
To: [log in to unmask]
Sent: Wed, Sep 30, 2009 11:28 am
Subject: Re: [TN] Immersion Silver for Class 3 Boards
Chester,
I am guessing here, but I think it was due to concerns about silver
embrittlement? If that is the case, I think that concern has proven to be a
little less likely. Do an TN archive search for a thread called "SnPbAg solder
and Immersion Silver PCBs" from Jan 2009. Also reference the accompanying
report IPC-TR-586, in which the 4-14 Plating Committee specifically researched
the effect of excess silver in solder joints. No evidence of such embrittlement
was found.
Kevin Glidden
Manufacturing Engineer
Luminescent Systems Inc.
-----Original Message-----
From: Harner, Chester [mailto:[log in to unmask]]
Sent: Wednesday, September 30, 2009 11:03 AM
To: [log in to unmask]
Subject: [TN] Immersion Silver for Class 3 Boards
The revised Immersion Silver IPC spec (4553A) indicates that Immersion
Silver is not recommended for Class 3 boards. There is no stated reason.
I have been looking into Immersion Silver for all the same reasons as
everyone else, to replace HASL for flatness etc. It looked very good
until the Class 3 problem.
Does anyone know why IAg would not be recommended for Class 3 boards?
Chet Harner Sr. Engineer Crane Hydro-AirePO Box 7722 Burbank Ca -
91510 818-526-2600 x3557
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