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September 2009

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Wed, 30 Sep 2009 10:49:09 -0500
Content-Type:
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MacDermid's IAg finish is an excellent all around choice. We have used
it for years, no problems ever seen.
I myself recommend it for my own clients. I have seen literally millions
of IAg boards built up. Very, very few problems compared to ENIG, HASL,
and especially OSP.
Paying attention to the packaging, handling and storage requirements are
the key to using IAg successfully.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Wednesday, September 30, 2009 10:29 AM
To: [log in to unmask]
Subject: Re: [TN] Immersion Silver for Class 3 Boards

Chet,
There were three papers on the sulfur issue at SMTAI 2007 by Randy
Schueller (Dell now DfR), Craig Hillman (DfR) and Lenora Toscano
(MacDermid).

IPC 3-11g under Don Cullen killed the turmoil about silver migration of
thin anti-tarnish immersion silver coatings.  Of course Nortel (dead)
and Lucent (taken over/merged?) knew this for years already.

The champagne voids issue has been fixed.

But if you are going to leave these things in a military depot for years
on end, you would have a problem.

Bev
RIM



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Thayer, Wayne - IIW
Sent: Wednesday, September 30, 2009 11:22 AM
To: [log in to unmask]
Subject: Re: [TN] Immersion Silver for Class 3 Boards

People panic about silver migration, which is not really an issue.

However, there apparently is a very serious problem that can occur on
uncoated boards in high sulfur environments, where somehow the silver
acts to catalytically cause the copper to redeposit in random
directions.  Doesn't even need a voltage to cause this phenomenon!

A paper on this was brought up to this forum several months back.  If
you search the archives on ImAg you should be able to find it.  The
growths are nice black dendrites.

Wayne Thayer

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Harner, Chester
Sent: Wednesday, September 30, 2009 11:03 AM
To: [log in to unmask]
Subject: [TN] Immersion Silver for Class 3 Boards

The revised Immersion Silver IPC spec (4553A) indicates that Immersion
Silver is not recommended for Class 3 boards. There is no stated reason.
I have been looking into Immersion Silver for all the same reasons as
everyone else, to replace HASL for flatness etc.  It looked very good
until the Class 3 problem.



Does anyone know why IAg would not be recommended for Class 3 boards?



Chet Harner   Sr. Engineer   Crane Hydro-AirePO Box 7722 Burbank Ca -
91510  818-526-2600 x3557




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