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September 2009

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Subject:
From:
Dennis Fritz <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 3 Sep 2009 18:03:50 -0400
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I would appreciate the pictures - please send to Steve.?? I have not heard of a connection between tin whiskers and CAF.? I have heard rumors that at about 6 gigahertz and above, tin whiskers act like antennas and degrade signal quality, but only a rumor - unpublished. 



Denny Fritz


-----Original Message-----
From: Inge <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, Sep 3, 2009 3:15 pm
Subject: [TN] BGA Pb-free, this is what I feared: Tin whiskers



We have HASL and via-in-pad. Electrical issues, disturbed signals. There were hundreds of Tin whiskers on inside of the unfilled vias, and even whiskers from solder pads circumperiphery, pointing at the nearby solder pads. I suspect that the signal failures are caused by CAFs. Have any of you seen a connection between the presence of Tin whiskers and CAF growth??
?
All BGA via-in-pads are solder mask defined. If you want photos, I can send a couple to the PA immigrant.?
?
/Inge ?
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