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September 2009

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Subject:
Re: What through-hole components cause the most process issues?
From:
Hernefjord Ingemar <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Hernefjord Ingemar <[log in to unmask]>
Date:
Tue, 29 Sep 2009 08:37:20 +0200
Content-Type:
text/plain
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text/plain (46 lines) 
Karen,

Any components with poor lead finish and poor solderability

Inge

 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Karen Tellefsen
Sent: måndag 28 september 2009 17:34
To: [log in to unmask]
Subject: [TN] What through-hole components cause the most process issues?

This is for all you process engineers.

What though-hole components cause the most trouble:

those with many high density pins

components with a lot of heat capaticty, such as heat sinks, transformers, etc.?

Anything else?

Do you wave solder glued  SMT components, are any of these problematic?

Thanks for your help.

Karen Tellefsen - Electrical Testing
[log in to unmask]
908-791-3069

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