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September 2009

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Subject:
From:
Ken Bloomquist <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ken Bloomquist <[log in to unmask]>
Date:
Mon, 28 Sep 2009 13:36:28 -0800
Content-Type:
text/plain
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Hi Gregg,

I believe the big concern in 610 and 001 is the inability to rework the
solder joint, if required, when there is bonding on it. As far as
reliability I believe that you could screen for that during qualification
testing.

KennyB

-----Original Message-----
From: Gregg Owens [mailto:[log in to unmask]] 
Sent: Monday, September 28, 2009 1:58 PM
To: [log in to unmask]
Subject: [TN] Component Staking

Hello all,

It's good to be back on TechNet once again. I have a question I could
directly answer so I thought I would put it out to the  friendly experts of
TechNet.

After soldering and during the component staking process some adhesive has
migrated onto adjacent solder connections and land areas. Could this become
detrimental in a high vibration environment? I know from 610 and 001 that
adhesive shall not contaminate the creation of the solder connection.
However this is AFTER the soldering process is complete would this be a
concern?

Any thoughts? Thanks in advance,

Gregg Owens, CIT
Technical Writer - Avionics
Space Exploration Technologies
1 Rocket Road | Hawthorne | CA | 90250
310-363-6000
[log in to unmask]


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