Hi Gregg,
It all DEPENDS. If the staking compound creates a stress concentration, operating T's could fall below about -20C, and the modulus of the staking compound is high, it could cause earlier failures.
Is it likely, not very.
Werner


 


 

-----Original Message-----
From: Gregg Owens <[log in to unmask]>
To: [log in to unmask]
Sent: Mon, Sep 28, 2009 4:58 pm
Subject: [TN] Component Staking










Hello all,

It's good to be back on TechNet once again. I have a question I could directly 
answer so I thought I would put it out to the  friendly experts of TechNet.

After soldering and during the component staking process some adhesive has 
migrated onto adjacent solder connections and land areas. Could this become 
detrimental in a high vibration environment? I know from 610 and 001 that 
adhesive shall not contaminate the creation of the solder connection. However 
this is AFTER the soldering process is complete would this be a concern?

Any thoughts? Thanks in advance,

Gregg Owens, CIT
Technical Writer - Avionics
Space Exploration Technologies
1 Rocket Road | Hawthorne | CA | 90250
310-363-6000
[log in to unmask]


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