Hello all,

It's good to be back on TechNet once again. I have a question I could directly answer so I thought I would put it out to the  friendly experts of TechNet.

After soldering and during the component staking process some adhesive has migrated onto adjacent solder connections and land areas. Could this become detrimental in a high vibration environment? I know from 610 and 001 that adhesive shall not contaminate the creation of the solder connection. However this is AFTER the soldering process is complete would this be a concern?

Any thoughts? Thanks in advance,

Gregg Owens, CIT
Technical Writer - Avionics
Space Exploration Technologies
1 Rocket Road | Hawthorne | CA | 90250
310-363-6000
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